BYCHIPS is the stocking distributor for CYD09S72V-167BBC, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CYD09S72V-167BBC by email, we will give you a best price according your plan.
Buy CYD09S72V-167BBC with BYCHPS
Buy with guarantee
CYD09S72V-167BBC
- Part Number:
- CYD09S72V-167BBC
- Manufacturer:
- Cypress Semiconductor
- Description:
- IC SRAM 9MBIT 167MHZ 484FBGA
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 18281 Pieces
- Data sheet:
- CYD09S72V-167BBC.pdf
Introduction
Specifications
| Voltage - Supply: | 1.42 V ~ 1.58 V, 1.7 V ~ 1.9 V |
|---|---|
| Supplier Device Package: | 484-FBGA (23x23) |
| Speed: | 167MHz |
| Series: | - |
| Packaging: | Tray |
| Package / Case: | 484-BGA |
| Operating Temperature: | 0°C ~ 70°C (TA) |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Memory Type: | Volatile |
| Memory Size: | 9Mb (128K x 72) |
| Memory Format: | SRAM |
| Manufacturer Part Number: | CYD09S72V-167BBC |
| Interface: | Parallel |
| Description: | IC SRAM 9MBIT 167MHZ 484FBGA |
| Email: | [email protected] |
Related parts for CYD09S72V-167BBC
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
CYD09S72V18-250BBXC | Cypress Semiconductor Corp | IC SRAM 9MBIT 250MHZ 256FBGA | Inquiry |
|
CYD09S72V18-200BBXC | Cypress Semiconductor Corp | IC SRAM 9MBIT 200MHZ 256FBGA | Inquiry |
 |
CYD09S72V-133BBC | Cypress Semiconductor Corp | IC SRAM 9MBIT 133MHZ 484FBGA | Inquiry |
|
CYD09S72V18-167BBXI | Cypress Semiconductor Corp | IC SRAM 9MBIT 167MHZ 256FBGA | Inquiry |
 |
CYD09S72V18-200BGXI | Cypress Semiconductor Corp | IC SRAM 9MBIT 200MHZ 484FBGA | Inquiry |
|
CYD09S72V18-167BBXC | Cypress Semiconductor Corp | IC SRAM 9MBIT 167MHZ 256FBGA | Inquiry |
|
CYD09S72V18-200BBXI | Cypress Semiconductor Corp | IC SRAM 9MBIT 200MHZ 256FBGA | Inquiry |
|
CYD09S72V-133BBI | Cypress Semiconductor Corp | IC SRAM 9MBIT 133MHZ 484FBGA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers