BYCHIPS is the stocking distributor for CY62127DV30LL-55BVXI, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CY62127DV30LL-55BVXI by email, we will give you a best price according your plan.
Buy CY62127DV30LL-55BVXI with BYCHPS
Buy with guarantee
CY62127DV30LL-55BVXI
- Part Number:
- CY62127DV30LL-55BVXI
- Manufacturer:
- Cypress Semiconductor
- Description:
- IC SRAM 1MBIT 55NS 48VFBGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15034 Pieces
- Data sheet:
- CY62127DV30LL-55BVXI.pdf
Introduction
Specifications
| Voltage - Supply: | 2.2 V ~ 3.6 V |
|---|---|
| Supplier Device Package: | 48-VFBGA (6x8) |
| Speed: | 55ns |
| Series: | MoBL® |
| Packaging: | Tray |
| Package / Case: | 48-VFBGA |
| Other Names: | 428-2064 CY62127DV30LL-55BVXI-ND CY62127DV30LL55BVXI |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Memory Type: | Volatile |
| Memory Size: | 1Mb (64K x 16) |
| Memory Format: | SRAM |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | CY62127DV30LL-55BVXI |
| Interface: | Parallel |
| Description: | IC SRAM 1MBIT 55NS 48VFBGA |
| Email: | [email protected] |
Related parts for CY62127DV30LL-55BVXI
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
CY62127DV30LL-55ZXIT | Cypress Semiconductor Corp | IC SRAM 1MBIT 55NS 44TSOP | Inquiry |
|
CY62127DV30LL-55ZXI | Cypress Semiconductor Corp | IC SRAM 1MBIT 55NS 44TSOP | Inquiry |
 |
CY62127DV30LL-55BVXIT | Cypress Semiconductor Corp | IC SRAM 1MBIT 55NS 48VFBGA | Inquiry |
|
CY62127DV30L-55BVXE | Cypress Semiconductor Corp | IC SRAM 1MBIT 55NS 48VFBGA | Inquiry |
|
CY62127DV30L-55ZSXE | Cypress Semiconductor Corp | IC SRAM 1MBIT 55NS 44TSOP | Inquiry |
|
CY62127DV30L-55BVXET | Cypress Semiconductor Corp | IC SRAM 1MBIT 55NS 48VFBGA | Inquiry |
|
CY62127DV30L-55ZSXET | Cypress Semiconductor Corp | IC SRAM 1MBIT 55NS 44TSOP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers