BYCHIPS is the stocking distributor for CSPUA877BVG, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CSPUA877BVG by email, we will give you a best price according your plan.
Buy CSPUA877BVG with BYCHPS
Buy with guarantee
CSPUA877BVG
- Part Number:
- CSPUA877BVG
- Manufacturer:
- IDT (Integrated Device Technology)
- Description:
- IC PLL CLK DVR SDRAM 52-CABGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13859 Pieces
- Data sheet:
- 1.CSPUA877BVG.pdf2.CSPUA877BVG.pdf
Introduction
Specifications
| Voltage - Supply: | 1.7 V ~ 1.9 V |
|---|---|
| Supplier Device Package: | 52-CABGA (4.5x7.0) |
| Series: | - |
| Ratio - Input:Output: | 1:10 |
| Packaging: | Tray |
| Package / Case: | 52-VFBGA |
| PLL: | Yes |
| Output: | Clock |
| Other Names: | IDTCSPUA877BVG IDTCSPUA877BVG-ND |
| Operating Temperature: | 0°C ~ 70°C |
| Number of Circuits: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | CSPUA877BVG |
| Main Purpose: | Memory, DDR2, SDRAM |
| Input: | Clock |
| Frequency - Max: | 410MHz |
| Differential - Input:Output: | Yes/Yes |
| Description: | IC PLL CLK DVR SDRAM 52-CABGA |
| Email: | [email protected] |
Related parts for CSPUA877BVG
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
CSPUA877ABVG | IDT, Integrated Device Technology Inc | IC SDRAM CLK DVR 1:10 52-VFBGA | Inquiry |
 |
CSPUA877ABVG8 | IDT, Integrated Device Technology Inc | IC PLL CLK DVR SDRAM 52-CABGA | Inquiry |
 |
CSPUA877ANLG | IDT, Integrated Device Technology Inc | IC PLL CLK DVR SDRAM 40-VFQFPN | Inquiry |
|
CSPUA877ANLG8 | IDT, Integrated Device Technology Inc | IC PLL CLK DVR SDRAM 40-VFQFPN | Inquiry |
|
CSPUA877BVG8 | IDT, Integrated Device Technology Inc | IC PLL CLK DVR SDRAM 52-CABGA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers