BYCHIPS is the stocking distributor for CKG45NX7R1H335M500JJ, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CKG45NX7R1H335M500JJ by email, we will give you a best price according your plan.
Buy CKG45NX7R1H335M500JJ with BYCHPS
Buy with guarantee
CKG45NX7R1H335M500JJ
- Part Number:
- CKG45NX7R1H335M500JJ
- Manufacturer:
- TDK Corporation
- Description:
- CAP CER 3.3UF 50V X7R SMD
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13346 Pieces
Introduction
Specifications
| Voltage - Rated: | 50V |
|---|---|
| Tolerance: | ±20% |
| Thickness (Max): | 0.217" (5.50mm) |
| Temperature Coefficient: | X7R |
| Size / Dimension: | 0.197" L x 0.138" W (5.00mm x 3.50mm) |
| Series: | MEGACAP, CKG |
| Ratings: | AEC-Q200 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | Stacked SMD, 2 J-Lead |
| Other Names: | 445-10409-2 CKG45NX7R1H335MT0Y9W |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount, MLCC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 18 Weeks |
| Manufacturer Part Number: | CKG45NX7R1H335M500JJ |
| Lead Style: | J-Lead |
| Lead Spacing: | - |
| Height - Seated (Max): | - |
| Features: | Low ESL (Stacked) |
| Failure Rate: | - |
| Expanded Description: | 3.3µF ±20% 50V Ceramic Capacitor X7R Stacked SMD, 2 J-Lead |
| Description: | CAP CER 3.3UF 50V X7R SMD |
| Capacitance: | 3.3µF |
| Applications: | Automotive, SMPS Filtering, Bypass, Decoupling |
| Email: | [email protected] |
Related parts for CKG45NX7R1H335M500JJ
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
CKG45NX7R1E106M500JH | TDK Corporation | CAP CER 10UF 25V X7R SMD | Inquiry |
|
CKG45NX7R1H335M500JH | TDK Corporation | CAP CER 3.3UF 50V X7R SMD | Inquiry |
|
CKG45NX7T2J334M500JJ | TDK Corporation | CAP CER 0.33UF 630V X7T SMD | Inquiry |
|
CKG45NX7R2E105M500JJ | TDK Corporation | CAP CER 1UF 250V X7R SMD | Inquiry |
|
CKG45NX7R1H685M500JJ | TDK Corporation | CAP CER 6.8UF 50V X7R SMD | Inquiry |
|
CKG45NX7S1C476M500JJ | TDK Corporation | CAP CER 47UF 16V X7S SMD | Inquiry |
|
CKG45NX7R1C226M500JH | TDK Corporation | CAP CER 22UF 16V X7R SMD | Inquiry |
|
CKG45NX7R1C226M500JJ | TDK Corporation | CAP CER 22UF 16V X7R SMD | Inquiry |
|
CKG45NX7R1H685M500JH | TDK Corporation | CAP CER 6.8UF 50V X7R SMD | Inquiry |
|
CKG45NX7R2A225M500JH | TDK Corporation | CAP CER 2.2UF 100V X7R SMD | Inquiry |
|
CKG45NX7S2A685M500JJ | TDK Corporation | CAP CER 6.8UF 100V X7S SMD | Inquiry |
|
CKG45NX7T2E225M500JH | TDK Corporation | CAP CER 2.2UF 250V X7T SMD | Inquiry |
|
CKG45NX7R1E106M500JJ | TDK Corporation | CAP CER 10UF 25V X7R SMD | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers