BYCHIPS is the stocking distributor for CGB2A3X5R0J105K033BB, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CGB2A3X5R0J105K033BB by email, we will give you a best price according your plan.
Buy CGB2A3X5R0J105K033BB with BYCHPS
Buy with guarantee
CGB2A3X5R0J105K033BB
- Part Number:
- CGB2A3X5R0J105K033BB
- Manufacturer:
- TDK Corporation
- Description:
- CAP CER 1UF 6.3V X5R 0402
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14547 Pieces
Introduction
Specifications
| Voltage - Rated: | 6.3V |
|---|---|
| Tolerance: | ±10% |
| Thickness (Max): | 0.013" (0.33mm) |
| Temperature Coefficient: | X5R |
| Size / Dimension: | 0.039" L x 0.020" W (1.00mm x 0.50mm) |
| Series: | CGB |
| Ratings: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 0402 (1005 Metric) |
| Other Names: | 445-13209-2 CGB2A3X5R0J105KT000N |
| Operating Temperature: | -55°C ~ 85°C |
| Mounting Type: | Surface Mount, MLCC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | CGB2A3X5R0J105K033BB |
| Lead Style: | - |
| Lead Spacing: | - |
| Height - Seated (Max): | - |
| Features: | Low Profile |
| Failure Rate: | - |
| Expanded Description: | 1µF ±10% 6.3V Ceramic Capacitor X5R 0402 (1005 Metric) |
| Description: | CAP CER 1UF 6.3V X5R 0402 |
| Capacitance: | 1µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for CGB2A3X5R0J105K033BB
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
CGB2A3JB0J105K033BB | TDK Corporation | CAP CER 1UF 6.3V JB 0402 | Inquiry |
|
CGB2A3X5R0G105M033BB | TDK Corporation | CAP CER 1UF 4V X5R 0402 | Inquiry |
|
CGB2A3X5R0J105M033BB | TDK Corporation | CAP CER 1UF 6.3V X5R 0402 | Inquiry |
|
CGB2A3X5R0G105K033BB | TDK Corporation | CAP CER 1UF 4V X5R 0402 | Inquiry |
|
CGB2A3JB0G105M033BB | TDK Corporation | CAP CER 1UF 4V JB 0402 | Inquiry |
|
CGB2A3X6S0J474K033BB | TDK Corporation | CAP CER 0.47UF 6.3V X6S 0402 | Inquiry |
|
CGB2A3X5R1A474M033BB | TDK Corporation | CAP CER 0.47UF 10V X5R 0402 | Inquiry |
|
CGB2A3X5R1A474K033BB | TDK Corporation | CAP CER 0.47UF 10V X5R 0402 | Inquiry |
|
CGB2A3JB0J105M033BB | TDK Corporation | CAP CER 1UF 6.3V JB 0402 | Inquiry |
|
CGB2A3JB1A474M033BB | TDK Corporation | CAP CER 0.47UF 10V JB 0402 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers