BYCHIPS is the stocking distributor for C3225X7T2E334M200AE, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for C3225X7T2E334M200AE by email, we will give you a best price according your plan.
Buy C3225X7T2E334M200AE with BYCHPS
Buy with guarantee
C3225X7T2E334M200AE
- Part Number:
- C3225X7T2E334M200AE
- Manufacturer:
- TDK Corporation
- Description:
- CAP CER 0.33UF 250V X7T 1210
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14469 Pieces
Introduction
Specifications
| Voltage - Rated: | 250V |
|---|---|
| Tolerance: | ±20% |
| Thickness (Max): | 0.091" (2.30mm) |
| Temperature Coefficient: | X7T |
| Size / Dimension: | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
| Series: | C |
| Ratings: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 1210 (3225 Metric) |
| Other Names: | C3225X7T2E334MT000S |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount, MLCC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | C3225X7T2E334M200AE |
| Lead Style: | - |
| Lead Spacing: | - |
| Height - Seated (Max): | - |
| Features: | Soft Termination |
| Failure Rate: | - |
| Expanded Description: | 0.33µF ±20% 250V Ceramic Capacitor X7T 1210 (3225 Metric) |
| Description: | CAP CER 0.33UF 250V X7T 1210 |
| Capacitance: | 0.33µF |
| Applications: | Boardflex Sensitive |
| Email: | [email protected] |
Related parts for C3225X7T2E334M200AE
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
C3225X7T2W224M200AA | TDK Corporation | CAP CER 0.22UF 450V X7T 1210 | Inquiry |
|
C3225X7T2E334K200AE | TDK Corporation | CAP CER 0.33UF 250V X7T 1210 | Inquiry |
|
C3225X7T2E334K200AA | TDK Corporation | CAP CER 0.33UF 250V X7T 1210 | Inquiry |
|
C3225X7T2W224M200AE | TDK Corporation | CAP CER 0.22UF 450V X7T 1210 | Inquiry |
|
C3225X7T2E334M200AA | TDK Corporation | CAP CER 0.33UF 250V X7T 1210 | Inquiry |
|
C3225X7T2J154K200AC | TDK Corporation | CAP CER 0.15UF 630V X7T 1210 | Inquiry |
|
C3225X7T2W224K200AA | TDK Corporation | CAP CER 0.22UF 450V X7T 1210 | Inquiry |
 |
C3225X7T2J104M160AC | TDK Corporation | CAP CER 0.1UF 630V X7T 1210 | Inquiry |
|
C3225X7T2J104K160AC | TDK Corporation | CAP CER 0.1UF 630V X7T 1210 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers