BYCHIPS is the stocking distributor for BUB323ZT4G, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BUB323ZT4G by email, we will give you a best price according your plan.
Buy BUB323ZT4G with BYCHPS
Buy with guarantee
BUB323ZT4G
- Part Number:
- BUB323ZT4G
- Manufacturer:
- AMI Semiconductor / ON Semiconductor
- Description:
- TRANS NPN DARL 350V 10A D2PAK
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16155 Pieces
- Data sheet:
- BUB323ZT4G.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 350V |
|---|---|
| Vce Saturation (Max) @ Ib, Ic: | 1.7V @ 250mA, 10A |
| Transistor Type: | NPN - Darlington |
| Supplier Device Package: | D2PAK |
| Series: | - |
| Power - Max: | 150W |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Other Names: | BUB323ZT4GOS BUB323ZT4GOS-ND BUB323ZT4GOSTR |
| Operating Temperature: | -65°C ~ 175°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 20 Weeks |
| Manufacturer Part Number: | BUB323ZT4G |
| Frequency - Transition: | 2MHz |
| Expanded Description: | Bipolar (BJT) Transistor NPN - Darlington 350V 10A 2MHz 150W Surface Mount D2PAK |
| Description: | TRANS NPN DARL 350V 10A D2PAK |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 500 @ 5A, 4.6V |
| Current - Collector Cutoff (Max): | 100µA |
| Current - Collector (Ic) (Max): | 10A |
| Email: | [email protected] |
Related parts for BUB323ZT4G
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers