BYCHIPS is the stocking distributor for BU2373FV-E2, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BU2373FV-E2 by email, we will give you a best price according your plan.
Buy BU2373FV-E2 with BYCHPS
Buy with guarantee
BU2373FV-E2
- Part Number:
- BU2373FV-E2
- Manufacturer:
- LAPIS Semiconductor
- Description:
- IC HI PERFORMANCE VCO SSOP-B14
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12619 Pieces
- Data sheet:
- BU2373FV-E2.pdf
Introduction
Specifications
| Voltage - Supply: | 3 V ~ 5 V |
|---|---|
| Supplier Device Package: | 14-SSOPB |
| Series: | - |
| Ratio - Input:Output: | 1:1 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 14-TSSOP (0.173", 4.40mm Width) |
| PLL: | Yes |
| Output: | Clock |
| Other Names: | BU2373FV-E2-ND BU2373FV-E2TR BU2373FVE2 |
| Operating Temperature: | -20°C ~ 75°C |
| Number of Circuits: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | BU2373FV-E2 |
| Main Purpose: | Video |
| Input: | Clock |
| Frequency - Max: | 100MHz |
| Differential - Input:Output: | No/No |
| Description: | IC HI PERFORMANCE VCO SSOP-B14 |
| Email: | [email protected] |
Related parts for BU2373FV-E2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers