BYCHIPS is the stocking distributor for BU20065S-M3/45, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BU20065S-M3/45 by email, we will give you a best price according your plan.
Buy BU20065S-M3/45 with BYCHPS
Buy with guarantee
BU20065S-M3/45
- Part Number:
- BU20065S-M3/45
- Manufacturer:
- Vishay / Semiconductor - Diodes Division
- Description:
- RECTIFIER BRIDGE 20A 600V BU-5S
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19210 Pieces
- Data sheet:
- BU20065S-M3/45.pdf
Introduction
Specifications
| Voltage - Peak Reverse (Max): | 600V |
|---|---|
| Voltage - Forward (Vf) (Max) @ If: | 1.05V @ 10A |
| Technology: | Standard |
| Supplier Device Package: | isoCINK+™ BU-5S |
| Series: | - |
| Packaging: | Tube |
| Package / Case: | 4-SIP, BU-5S |
| Operating Temperature: | -55°C ~ 150°C (TJ) |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 29 Weeks |
| Manufacturer Part Number: | BU20065S-M3/45 |
| Expanded Description: | Bridge Rectifier Single Phase 600V 20A Through Hole isoCINK+™ BU-5S |
| Diode Type: | Single Phase |
| Description: | RECTIFIER BRIDGE 20A 600V BU-5S |
| Current - Reverse Leakage @ Vr: | 5µA @ 600V |
| Current - Average Rectified (Io): | 20A |
| Email: | [email protected] |
Related parts for BU20065S-M3/45
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers