BYCHIPS is the stocking distributor for BSP297 E6327, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BSP297 E6327 by email, we will give you a best price according your plan.
Buy BSP297 E6327 with BYCHPS
Buy with guarantee
BSP297 E6327
- Part Number:
- BSP297 E6327
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- MOSFET N-CH 200V 660MA SOT-223
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 18425 Pieces
- Data sheet:
- BSP297 E6327.pdf
Introduction
Specifications
| Vgs(th) (Max) @ Id: | 1.8V @ 400µA |
|---|---|
| Technology: | MOSFET (Metal Oxide) |
| Supplier Device Package: | PG-SOT223-4 |
| Series: | SIPMOS® |
| Rds On (Max) @ Id, Vgs: | 1.8 Ohm @ 660mA, 10V |
| Power Dissipation (Max): | 1.8W (Ta) |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | TO-261-4, TO-261AA |
| Other Names: | BSP297E6327T SP000011108 |
| Operating Temperature: | -55°C ~ 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | BSP297 E6327 |
| Input Capacitance (Ciss) (Max) @ Vds: | 357pF @ 25V |
| Gate Charge (Qg) (Max) @ Vgs: | 16.1nC @ 10V |
| FET Type: | N-Channel |
| FET Feature: | - |
| Expanded Description: | N-Channel 200V 660mA (Ta) 1.8W (Ta) Surface Mount PG-SOT223-4 |
| Drain to Source Voltage (Vdss): | 200V |
| Description: | MOSFET N-CH 200V 660MA SOT-223 |
| Current - Continuous Drain (Id) @ 25°C: | 660mA (Ta) |
| Email: | [email protected] |
Related parts for BSP297 E6327
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers