BYCHIPS is the stocking distributor for BO2-03, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BO2-03 by email, we will give you a best price according your plan.
Buy BO2-03 with BYCHPS
Buy with guarantee
BO2-03
- Part Number:
- BO2-03
- Manufacturer:
- Bussmann (Eaton)
- Description:
- FUSEHOLDER CAP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19071 Pieces
- Data sheet:
- BO2-03.pdf
Introduction
Specifications
| Series: | - |
|---|---|
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 7 Weeks |
| Manufacturer Part Number: | BO2-03 |
| For Use With/Related Products: | A2000 Series |
| Description: | FUSEHOLDER CAP |
| Accessory Type: | Cap (Cover) |
| Email: | [email protected] |
Related parts for BO2-03
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
1A1706-09 | Eaton | EYELET 2A ORANGE PNL MNT | Inquiry |
|
BO2-14 | Eaton | FUSEHOLDER CAP | Inquiry |
|
BO2-08 | Eaton | FUSEHOLDER CAP | Inquiry |
|
BO2-09 | Eaton | FUSEHOLDER CAP | Inquiry |
|
BO2-03BF | Eaton | FUSEHOLDER CAP | Inquiry |
 |
2905756 | Phoenix Contact | PLATE TO FIX SPARK GAP | Inquiry |
|
BO2-04 | Eaton | FUSEHOLDER CAP | Inquiry |
|
BO2-06 | Eaton | FUSEHOLDER CAP | Inquiry |
|
BO2-02TF | Eaton | FUSEHOLDER CAP | Inquiry |
 |
0031.2220 | Schurter Inc. | CARRIER FUSE 5X20MM SLOT PNL MNT | Inquiry |
|
BO2-07 | Eaton | FUSEHOLDER CAP | Inquiry |
 |
03540522Z | Littelfuse Inc. | FUSE ACS STORAGE DRAWER | Inquiry |
|
1A1063 | Eaton | PULL RING | Inquiry |
|
4208 | Eaton | TRON FUSECLIP | Inquiry |
|
BO2-10 | Eaton | FUSEHOLDER CAP | Inquiry |
|
BO2-16 | Eaton | FUSEHOLDER CAP | Inquiry |
|
BO2-02 | Eaton | FUSEHOLDER CAP | Inquiry |
|
BO2-12 | Eaton | FUSEHOLDER CAP | Inquiry |
|
BO2-04TF | Eaton | FUSEHOLDER CAP | Inquiry |
|
BO2-05 | Eaton | FUSEHOLDER CAP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers