BYCHIPS is the stocking distributor for BLS2731-110,114, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BLS2731-110,114 by email, we will give you a best price according your plan.
Buy BLS2731-110,114 with BYCHPS
Buy with guarantee
BLS2731-110,114
- Part Number:
- BLS2731-110,114
- Manufacturer:
- Ampleon
- Description:
- TRANSISTOR RF POWER SOT423A
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18521 Pieces
- Data sheet:
- BLS2731-110,114.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 75V |
|---|---|
| Transistor Type: | NPN |
| Supplier Device Package: | CDFM2 |
| Series: | - |
| Power - Max: | 500W |
| Packaging: | Tray |
| Package / Case: | SOT-423A |
| Other Names: | 934045780114 BLS2731-110 TRAY BLS2731-110 TRAY-ND |
| Operating Temperature: | 200°C (TJ) |
| Noise Figure (dB Typ @ f): | - |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | BLS2731-110,114 |
| Gain: | 7dB |
| Frequency - Transition: | 3.1GHz |
| Expanded Description: | RF Transistor NPN 75V 12A 3.1GHz 500W Surface Mount CDFM2 |
| Description: | TRANSISTOR RF POWER SOT423A |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 40 @ 3A, 5V |
| Current - Collector (Ic) (Max): | 12A |
| Email: | [email protected] |
Related parts for BLS2731-110,114
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
BLS2731-50,114 | Ampleon USA Inc. | TRANSISTOR RF POWER SOT422A | Inquiry |
 |
UPA806T-T1-A | CEL | RF DUAL TRANSISTORS NPN SOT-363 | Inquiry |
 |
BLS2731-20,114 | Ampleon USA Inc. | TRANSISTOR RF POWER SOT445C | Inquiry |
 |
BFR520T,115 | NXP USA Inc. | TRANS NPN 15V 9GHZ SOT-416 | Inquiry |
 |
MMBTH10RG | Fairchild/ON Semiconductor | TRANSISTOR RF NPN SOT23 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers