BYCHIPS is the stocking distributor for BLM8G0710S-45ABY, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BLM8G0710S-45ABY by email, we will give you a best price according your plan.
Buy BLM8G0710S-45ABY with BYCHPS
Buy with guarantee
BLM8G0710S-45ABY
- Part Number:
- BLM8G0710S-45ABY
- Manufacturer:
- Ampleon
- Description:
- RF FET LDMOS 65V 35DB SOT12112
- Lead Free Status / RoHS Status:
- Lead free by exemption / RoHS compliant by exemption
- Available Quantity:
- 16635 Pieces
- Data sheet:
- BLM8G0710S-45ABY.pdf
Introduction
Specifications
| Voltage - Test: | 28V |
|---|---|
| Voltage - Rated: | 65V |
| Transistor Type: | LDMOS (Dual) |
| Supplier Device Package: | 16-HSOPF |
| Series: | - |
| Power - Output: | 3W |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | SOT-1211-2 |
| Other Names: | 934069032518 BLM8G0710S-45ABY-ND |
| Noise Figure: | - |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 13 Weeks |
| Manufacturer Part Number: | BLM8G0710S-45ABY |
| Gain: | 35dB |
| Frequency: | 957.5MHz |
| Expanded Description: | RF Mosfet LDMOS (Dual) 28V 30mA 957.5MHz 35dB 3W 16-HSOPF |
| Description: | RF FET LDMOS 65V 35DB SOT12112 |
| Current Rating: | - |
| Current - Test: | 30mA |
| Email: | [email protected] |
Related parts for BLM8G0710S-45ABY
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
BLM8G0710S-30PBY | Ampleon USA Inc. | RF FET LDMOS 65V 35DB SOT12112 | Inquiry |
 |
BLM8G0710S-60PBGY | Ampleon USA Inc. | RF FET LDMOS 65V 36.2DB SOT12122 | Inquiry |
 |
BLM8G0710S-45ABGY | Ampleon USA Inc. | RF FET LDMOS 65V 35DB SOT12122 | Inquiry |
 |
BLM8G0710S-15PBGY | Ampleon USA Inc. | RF FET LDMOS 65V 36.1DB SOT12122 | Inquiry |
|
BLM8G0710S-15PBY | Ampleon USA Inc. | RF FET LDMOS 65V 36.1DB SOT12112 | Inquiry |
 |
BLM8G0710S-60PBY | Ampleon USA Inc. | RF FET LDMOS 65V 36.2DB SOT12112 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers