BYCHIPS is the stocking distributor for BFR 460L3 E6327, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BFR 460L3 E6327 by email, we will give you a best price according your plan.
Buy BFR 460L3 E6327 with BYCHPS
Buy with guarantee
BFR 460L3 E6327
- Part Number:
- BFR 460L3 E6327
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- TRANS RF NPN 5.8V 50MA 3TSLP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17465 Pieces
- Data sheet:
- BFR 460L3 E6327.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 5.8V |
|---|---|
| Transistor Type: | NPN |
| Supplier Device Package: | PG-TSLP-3 |
| Series: | - |
| Power - Max: | 200mW |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | SC-101, SOT-883 |
| Other Names: | BFR 460L3 E6327-ND BFR460L3E6327XT BFR460L3E6327XTMA1 SP000014238 |
| Operating Temperature: | 150°C (TJ) |
| Noise Figure (dB Typ @ f): | 1.1dB ~ 1.35dB @ 1.8GHz ~ 3GHz |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 6 Weeks |
| Manufacturer Part Number: | BFR 460L3 E6327 |
| Gain: | 16dB |
| Frequency - Transition: | 22GHz |
| Expanded Description: | RF Transistor NPN 5.8V 50mA 22GHz 200mW Surface Mount PG-TSLP-3 |
| Description: | TRANS RF NPN 5.8V 50MA 3TSLP |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 90 @ 20mA, 3V |
| Current - Collector (Ic) (Max): | 50mA |
| Email: | [email protected] |
Related parts for BFR 460L3 E6327
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers