BYCHIPS is the stocking distributor for BFG21W,115, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BFG21W,115 by email, we will give you a best price according your plan.
Buy BFG21W,115 with BYCHPS
Buy with guarantee
BFG21W,115
- Part Number:
- BFG21W,115
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- TRANS NPN 15V .5A 18GHZ CMPAK-4
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12147 Pieces
- Data sheet:
- BFG21W,115.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 4.5V |
|---|---|
| Transistor Type: | NPN |
| Supplier Device Package: | CMPAK-4 |
| Series: | - |
| Power - Max: | 600mW |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | SC-82A, SOT-343 |
| Other Names: | 568-1974-2 934047480115 BFG21W T/R |
| Operating Temperature: | 150°C (TJ) |
| Noise Figure (dB Typ @ f): | - |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | BFG21W,115 |
| Gain: | - |
| Frequency - Transition: | 18GHz |
| Expanded Description: | RF Transistor NPN 4.5V 500mA 18GHz 600mW Surface Mount CMPAK-4 |
| Description: | TRANS NPN 15V .5A 18GHZ CMPAK-4 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 40 @ 200mA, 2V |
| Current - Collector (Ic) (Max): | 500mA |
| Email: | [email protected] |
Related parts for BFG21W,115
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
1517-20M | Microsemi Corporation | TRANS RF BIPO 175W 3A 55LV1 | Inquiry |
 |
2SC5226A-5-TL-E | ON Semiconductor | TRANS NPN BIPO VHF-UHF MCP | Inquiry |
 |
2SC5752-T1-A | CEL | RF TRANSISTOR NPN SOT-343 | Inquiry |
 |
NE696M01-T1-A | CEL | TRANSISTOR NPN 2GHZ SOT-363 | Inquiry |
|
MSC1450M | Microsemi Corporation | TRANS RF BIPO 910W 28A M216 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers