BYCHIPS is the stocking distributor for BFC238352333, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BFC238352333 by email, we will give you a best price according your plan.
Buy BFC238352333 with BYCHPS
Buy with guarantee
BFC238352333
- Part Number:
- BFC238352333
- Manufacturer:
- Angstrohm / Vishay
- Description:
- CAP FILM 0.033UF 5% 1.6KVDC RAD
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18165 Pieces
- Data sheet:
- BFC238352333.pdf
Introduction
Specifications
| Voltage Rating - DC: | 1600V (1.6kV) |
|---|---|
| Voltage Rating - AC: | 550V |
| Tolerance: | ±5% |
| Termination: | PC Pins |
| Size / Dimension: | 1.024" L x 0.394" W (26.00mm x 10.00mm) |
| Series: | 383 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | Radial |
| Other Names: | 2222 383 52333 222238352333 BFC2 383 52333 BFC2 383 52333 |
| Operating Temperature: | -55°C ~ 105°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | BFC238352333 |
| Lead Spacing: | 0.886" (22.50mm) |
| Height - Seated (Max): | 0.768" (19.50mm) |
| Features: | - |
| Expanded Description: | 0.033µF ±5% Film Capacitor 550V 1600V (1.6kV) Polypropylene (PP), Metallized Radial |
| ESR (Equivalent Series Resistance): | - |
| Dielectric Material: | Polypropylene (PP), Metallized |
| Description: | CAP FILM 0.033UF 5% 1.6KVDC RAD |
| Capacitance: | 0.033µF |
| Applications: | High Pulse, DV/DT |
| Email: | [email protected] |
Related parts for BFC238352333
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers