BYCHIPS is the stocking distributor for BD3873FS-E2, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BD3873FS-E2 by email, we will give you a best price according your plan.
Buy BD3873FS-E2 with BYCHPS
Buy with guarantee
BD3873FS-E2
- Part Number:
- BD3873FS-E2
- Manufacturer:
- LAPIS Semiconductor
- Description:
- IC SOUND PROCESSOR 24-SSOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15864 Pieces
- Data sheet:
- BD3873FS-E2.pdf
Introduction
Specifications
| Voltage - Supply: | 4.5 V ~ 9.5 V |
|---|---|
| Supplier Device Package: | 24-SSOPA |
| Specifications: | - |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 24-SOP (0.213", 5.40mm Width) |
| Other Names: | BD3873FSE2 |
| Operating Temperature: | -25°C ~ 75°C (TA) |
| Number of Channels: | 2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | BD3873FS-E2 |
| Interface: | SPI |
| Function: | Audio Signal Processor |
| Expanded Description: | Audio Audio Signal Processor 2 Channel 24-SSOPA |
| Description: | IC SOUND PROCESSOR 24-SSOP |
| Applications: | Consumer Audio |
| Email: | [email protected] |
Related parts for BD3873FS-E2
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
BD3870FS-E2 | Rohm Semiconductor | IC SOUND PROCESSOR SSOP-A24 | Inquiry |
 |
TAS5028APAGR | Texas Instruments | IC AUDIO PWM PROC 64TQFP | Inquiry |
|
BD3871FS-E2 | Rohm Semiconductor | IC SOUND PROCESSOR SSOP-A24 TR | Inquiry |
|
BD3872FS-E2 | Rohm Semiconductor | IC SOUND PROCESSOR SSOP-A32 | Inquiry |
|
TAS5518PAGR | Texas Instruments | IC PWM PROC 8CH DIG AUDIO 64TQFP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers