BYCHIPS is the stocking distributor for BCAP1500 P270 K04, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BCAP1500 P270 K04 by email, we will give you a best price according your plan.
Buy BCAP1500 P270 K04 with BYCHPS
Buy with guarantee
BCAP1500 P270 K04
- Part Number:
- BCAP1500 P270 K04
- Manufacturer:
- Maxwell Technologies, Inc.
- Description:
- CAP 1500F 2.7V THREADED
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18276 Pieces
- Data sheet:
- BCAP1500 P270 K04.pdf
Introduction
Specifications
| Voltage - Rated: | 2.7V |
|---|---|
| Tolerance: | - |
| Termination: | Threaded Stud |
| Size / Dimension: | 2.390" Dia (60.70mm) |
| Series: | K2 |
| Packaging: | Bulk |
| Package / Case: | Axial, Can - Screw Terminals |
| Other Names: | 108385B 1182-1019 BCAP1500P270K04 |
| Operating Temperature: | -40°C ~ 65°C |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 4 Weeks |
| Manufacturer Part Number: | BCAP1500 P270 K04 |
| Lifetime @ Temp.: | 1500 Hrs @ 65°C |
| Lead Spacing: | - |
| Height - Seated (Max): | 3.358" (85.30mm) |
| Expanded Description: | 1500F (EDLC) Supercapacitor 2.7V Axial, Can - Screw Terminals 0.47 mOhm 1500 Hrs @ 65°C |
| ESR (Equivalent Series Resistance): | 0.47 mOhm |
| Description: | CAP 1500F 2.7V THREADED |
| Capacitance: | 1500F |
| Email: | [email protected] |
Related parts for BCAP1500 P270 K04
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
BCAP1500 P270 K05 | Maxwell Technologies Inc. | CAP 1500F 2.7V WELD | Inquiry |
 |
BCAP1200 P270 K05 | Maxwell Technologies Inc. | CAP 1200F 2.7V WELD | Inquiry |
 |
MAL219691111E3 | Vishay BC Components | CAP ALUM 4F 1.4V SNAP | Inquiry |
 |
PM-5R0H305-R | Eaton | CAP 3F -20% +80% 5V T/H | Inquiry |
 |
BCAP1200 P270 K04 | Maxwell Technologies Inc. | CAP 1200F 2.7V THREADED | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers