BYCHIPS is the stocking distributor for B39371B3677U310, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for B39371B3677U310 by email, we will give you a best price according your plan.
Buy B39371B3677U310 with BYCHPS
Buy with guarantee
B39371B3677U310
- Part Number:
- B39371B3677U310
- Manufacturer:
- Epcos / RF360
- Description:
- FILTER SAW 374.0MHZ SMD
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12491 Pieces
- Data sheet:
- B39371B3677U310.pdf
Introduction
Specifications
| Size / Dimension: | 0.197" L x 0.197" W (5.00mm x 5.00mm) |
|---|---|
| Series: | - |
| Ratings: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 8-SMD, No Lead |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | B39371B3677U310 |
| Insertion Loss: | 8.5dB |
| Height (Max): | 0.053" (1.35mm) |
| Frequency - Center: | 374MHz |
| Description: | FILTER SAW 374.0MHZ SMD |
| Bandwidth: | 22MHz |
| Applications: | IF |
| Email: | [email protected] |
Related parts for B39371B3677U310
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
B39371B3643Z710 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 371MHZ LOWLOSS SMD | Inquiry |
 |
B39371B5025Z810 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 374MHZ LOWLOSS SMD | Inquiry |
 |
SF2040B-2 | Murata Electronics North America | SAW FILTER IF 80.46MHZ SMP-03 | Inquiry |
|
B39431R904U410V9 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | SAW RES SMD | Inquiry |
|
B39251B3892H510 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW IF 248.6MHZ SMD | Inquiry |
 |
B39431B3932H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 434.17MHZ SMD | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers