BYCHIPS is the stocking distributor for B07D034BB2-0120, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for B07D034BB2-0120 by email, we will give you a best price according your plan.
Buy B07D034BB2-0120 with BYCHPS
Buy with guarantee
B07D034BB2-0120
- Part Number:
- B07D034BB2-0120
- Manufacturer:
- Aerospace Defense and Marine / TE Connectivity
- Description:
- RELAY GEN PURPOSE DPDT 10A 12V
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 15899 Pieces
- Data sheet:
- B07D034BB2-0120.pdf
Introduction
Specifications
| Turn On Voltage (Max): | 6.5 VDC |
|---|---|
| Turn Off Voltage (Min): | 0.8 VDC |
| Termination Style: | PC Pin |
| Switching Voltage: | 115VAC, 28VDC - Max |
| Series: | Military, MIL-R-5757/23, 07, CII |
| Release Time: | 15ms |
| Relay Type: | General Purpose |
| Packaging: | Bulk |
| Other Names: | 1122-1010 1122-1010-MIL 1617004-9 A101560 A101560-ND B07D034BB20120 M5757/23-010 |
| Operating Temperature: | -65°C ~ 125°C |
| Operate Time: | 15ms |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 27 Weeks |
| Manufacturer Part Number: | B07D034BB2-0120 |
| Features: | Sealed - Hermetically |
| Expanded Description: | General Purpose Relay DPDT (2 Form C) 12VDC Coil Through Hole |
| Description: | RELAY GEN PURPOSE DPDT 10A 12V |
| Contact Rating (Current): | 10A |
| Contact Material: | Silver Cadmium Oxide (AgCdO) |
| Contact Form: | DPDT (2 Form C) |
| Coil Voltage: | 12VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 75 Ohms |
| Coil Power: | 1.92 W |
| Coil Current: | 160mA |
| Email: | [email protected] |
Related parts for B07D034BB2-0120
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers