BYCHIPS is the stocking distributor for ATPL230AG55J19-Y, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ATPL230AG55J19-Y by email, we will give you a best price according your plan.
Buy ATPL230AG55J19-Y with BYCHPS
Buy with guarantee
ATPL230AG55J19-Y
- Part Number:
- ATPL230AG55J19-Y
- Manufacturer:
- Micrel / Microchip Technology
- Description:
- PL230A-AKU-Y SAMG55J19A-MU LQFP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14093 Pieces
- Data sheet:
- ATPL230AG55J19-Y.pdf
Introduction
Specifications
| Series: | * |
|---|---|
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 24 Weeks |
| Manufacturer Part Number: | ATPL230AG55J19-Y |
| Description: | PL230A-AKU-Y SAMG55J19A-MU LQFP |
| Email: | [email protected] |
Related parts for ATPL230AG55J19-Y
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
ATPL230A-AKU-Y | Microchip Technology | IC PWR LINE MCU 80LQFP | Inquiry |
 |
ATPL220A-A1U-Y | Microchip Technology | IC PWR LINE MCU 120LQFP | Inquiry |
|
ATPL230AG55J19-R | Microchip Technology | PL230A-AKU-R SAMG55J19A-MUT LQFP | Inquiry |
|
ATPL250A-AKU-R | Microchip Technology | IC PWR LINE MCU 80LQFP | Inquiry |
|
ATPL250A-AKU-Y | Microchip Technology | IC PWR LINE MCU 80LQFP | Inquiry |
|
ATPL230A-AKU-R | Microchip Technology | IC PWR LINE MCU 80LQFP | Inquiry |
|
SCH5620-MT | Microchip Technology | DESKTOP EMBEDDED CTRLR 100LQFP | Inquiry |
|
ATPL210A-A1U-Y | Microchip Technology | IC PWR LINE MCU 120LQFP | Inquiry |
|
ATPL250AG55J19-Y | Microchip Technology | PL250A-AKU-Y SAMG55J19A-MU LQFP | Inquiry |
|
ATPL250AG55J19-R | Microchip Technology | PL250A-AKU-R SAMG55J19A-MUT LQFP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers