BYCHIPS is the stocking distributor for APTSM120AM08CT6AG, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for APTSM120AM08CT6AG by email, we will give you a best price according your plan.
Buy APTSM120AM08CT6AG with BYCHPS
Buy with guarantee
APTSM120AM08CT6AG
- Part Number:
- APTSM120AM08CT6AG
- Manufacturer:
- Microsemi
- Description:
- POWER MODULE - SIC
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15885 Pieces
- Data sheet:
- APTSM120AM08CT6AG.pdf
Introduction
Specifications
| Vgs(th) (Max) @ Id: | 3V @ 10mA |
|---|---|
| Supplier Device Package: | SP6 |
| Series: | - |
| Rds On (Max) @ Id, Vgs: | 10 mOhm @ 200A, 20V |
| Power - Max: | 2300W |
| Packaging: | Bulk |
| Package / Case: | SP6 |
| Operating Temperature: | -40°C ~ 175°C (TJ) |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 22 Weeks |
| Manufacturer Part Number: | APTSM120AM08CT6AG |
| Gate Charge (Qg) (Max) @ Vgs: | 1360nC @ 20V |
| FET Type: | 2 N-Channel (Dual), Schottky |
| FET Feature: | Silicon Carbide (SiC) |
| Expanded Description: | Mosfet Array 2 N-Channel (Dual), Schottky 1200V (1.2kV) 370A (Tc) 2300W Chassis Mount SP6 |
| Drain to Source Voltage (Vdss): | 1200V (1.2kV) |
| Description: | POWER MODULE - SIC |
| Current - Continuous Drain (Id) @ 25°C: | 370A (Tc) |
| Email: | [email protected] |
Related parts for APTSM120AM08CT6AG
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
APTSM120AM14CD3AG | Microsemi Corporation | POWER MODULE - SIC | Inquiry |
|
APTSM120TAM33CTPAG | Microsemi Corporation | POWER MODULE - SIC | Inquiry |
|
APTSM120AM25CT3AG | Microsemi Corporation | POWER MODULE - SIC | Inquiry |
|
APTSM120AM09CD3AG | Microsemi Corporation | POWER MODULE - SIC | Inquiry |
|
APTSM120AM55CT1AG | Microsemi Corporation | POWER MODULE - SIC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers