BYCHIPS is the stocking distributor for ALS71C273NW200, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ALS71C273NW200 by email, we will give you a best price according your plan.
Buy ALS71C273NW200 with BYCHPS
Buy with guarantee
ALS71C273NW200
- Part Number:
- ALS71C273NW200
- Manufacturer:
- KEMET
- Description:
- ALU SCREW TERMINAL 27000UF 200V
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18655 Pieces
- Data sheet:
- ALS71C273NW200.pdf
Introduction
Specifications
| Series: | * |
|---|---|
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 13 Weeks |
| Manufacturer Part Number: | ALS71C273NW200 |
| Expanded Description: | Aluminum Capacitors |
| Description: | ALU SCREW TERMINAL 27000UF 200V |
| Email: | [email protected] |
Related parts for ALS71C273NW200
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
ALS71C274NT063 | KEMET | ALU SCREW TERMINAL 270000UF 63V | Inquiry |
|
ALS71C274QC025 | KEMET | ALU SCREW TERMINAL 270000UF 25V | Inquiry |
|
ALS71C274NF040 | KEMET | ALU SCREW TERMINAL 270000UF 40V | Inquiry |
|
ALS71C273QW250 | KEMET | ALU SCREW TERMINAL 27000UF 250V | Inquiry |
|
ALS71C272QC500 | KEMET | ALU SCREW TERMINAL 2700UF 500V | Inquiry |
|
ALS71C272MF550 | KEMET | ALU SCREW TERMINAL 2700UF 550V | Inquiry |
|
ALS71C273NT250 | KEMET | ALU SCREW TERMINAL 27000UF 250V | Inquiry |
|
ALS71C274QW063 | KEMET | ALU SCREW TERMINAL 270000UF 63V | Inquiry |
|
ALS71C223NP200 | KEMET | ALU SCREW TERMINAL 22000UF 200V | Inquiry |
|
ALS71C272LM550 | KEMET | ALU SCREW TERMINAL 2700UF 550V | Inquiry |
|
ALS71C243QT350 | KEMET | ALU SCREW TERMINAL 24000UF 350V | Inquiry |
|
ALS71C243QM200 | KEMET | ALU SCREW TERMINAL 24000UF 200V | Inquiry |
|
ALS71C243NS250 | KEMET | ALU SCREW TERMINAL 24000UF 250V | Inquiry |
|
ALS71C274NJ040 | KEMET | ALU SCREW TERMINAL 270000UF 40V | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers