BYCHIPS is the stocking distributor for AD9211BCPZ-250, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for AD9211BCPZ-250 by email, we will give you a best price according your plan.
Buy AD9211BCPZ-250 with BYCHPS
Buy with guarantee
AD9211BCPZ-250
- Part Number:
- AD9211BCPZ-250
- Manufacturer:
- AD
- Description:
- IC ADC 10-BIT 250MSPS 56-LFCSP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17297 Pieces
- Data sheet:
- AD9211BCPZ-250.pdf
Introduction
Specifications
| Voltage - Supply, Digital: | 1.7 V ~ 1.9 V |
|---|---|
| Voltage - Supply, Analog: | 1.7 V ~ 1.9 V |
| Supplier Device Package: | 56-LFCSP-VQ (8x8) |
| Series: | - |
| Sampling Rate (Per Second): | 250M |
| Reference Type: | Internal |
| Ratio - S/H:ADC: | 1:1 |
| Packaging: | Tray |
| Package / Case: | 56-VFQFN Exposed Pad, CSP |
| Other Names: | AD9211BCPZ250 |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Inputs: | 1 |
| Number of Bits: | 10 |
| Number of A/D Converters: | 1 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | AD9211BCPZ-250 |
| Input Type: | Differential, Single Ended |
| Features: | Simultaneous Sampling |
| Expanded Description: | 10 Bit Analog to Digital Converter 1 Input 1 Pipelined 56-LFCSP-VQ (8x8) |
| Description: | IC ADC 10-BIT 250MSPS 56-LFCSP |
| Data Interface: | LVDS - Parallel |
| Configuration: | S/H-ADC |
| Architecture: | Pipelined |
| Email: | [email protected] |
Related parts for AD9211BCPZ-250
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers