BYCHIPS is the stocking distributor for 930C6S33K, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 930C6S33K by email, we will give you a best price according your plan.
Buy 930C6S33K with BYCHPS
Buy with guarantee
930C6S33K
- Part Number:
- 930C6S33K
- Manufacturer:
- Cornell Dubilier Electronics
- Description:
- CAP FILM 0.033UF 630VDC AXIAL
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 17377 Pieces
- Data sheet:
- 930C6S33K.pdf
Introduction
Specifications
| Voltage Rating - DC: | 630V |
|---|---|
| Voltage Rating - AC: | 250V |
| Tolerance: | ±10% |
| Termination: | PC Pins |
| Size / Dimension: | 0.335" Dia x 0.748" L (8.50mm x 19.00mm) |
| Series: | 930C |
| Packaging: | Bulk |
| Package / Case: | Axial |
| Operating Temperature: | -55°C ~ 105°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | 930C6S33K |
| Lead Spacing: | - |
| Height - Seated (Max): | - |
| Features: | - |
| Expanded Description: | 0.033µF ±10% Film Capacitor 250V 630V Polypropylene (PP), Metallized Axial |
| ESR (Equivalent Series Resistance): | - |
| Dielectric Material: | Polypropylene (PP), Metallized |
| Description: | CAP FILM 0.033UF 630VDC AXIAL |
| Capacitance: | 0.033µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for 930C6S33K
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers