BYCHIPS is the stocking distributor for 72T3655L5BB, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 72T3655L5BB by email, we will give you a best price according your plan.
Buy 72T3655L5BB with BYCHPS
Buy with guarantee
72T3655L5BB
- Part Number:
- 72T3655L5BB
- Manufacturer:
- IDT (Integrated Device Technology)
- Description:
- IC FIFO 2048X36 5NS 208-BGA
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 14779 Pieces
- Data sheet:
- 72T3655L5BB.pdf
Introduction
Specifications
| Voltage - Supply: | 2.375 V ~ 2.625 V |
|---|---|
| Supplier Device Package: | 208-PBGA (17x17) |
| Series: | 72T |
| Retransmit Capability: | Yes |
| Programmable Flags Support: | Yes |
| Packaging: | Tray |
| Package / Case: | 208-BGA |
| Other Names: | IDT72T3655L5BB IDT72T3655L5BB-ND |
| Operating Temperature: | 0°C ~ 70°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Memory Size: | 72K (2K x 36) |
| Manufacturer Part Number: | 72T3655L5BB |
| Function: | Asynchronous, Synchronous |
| FWFT Support: | Yes |
| Expansion Type: | Depth, Width |
| Description: | IC FIFO 2048X36 5NS 208-BGA |
| Data Rate: | 83MHz, 200MHz |
| Current - Supply (Max): | 70mA |
| Bus Directional: | Uni-Directional |
| Access Time: | 10ns, 3.6ns |
| Email: | [email protected] |
Related parts for 72T3655L5BB
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers