BYCHIPS is the stocking distributor for 5521814, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 5521814 by email, we will give you a best price according your plan.
Buy 5521814 with BYCHPS
Buy with guarantee
5521814
- Part Number:
- 5521814
- Manufacturer:
- Phoenix Contact
- Description:
- RELAY SOCKET
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12340 Pieces
- Data sheet:
- 5521814.pdf
Introduction
Specifications
| Type: | Socket |
|---|---|
| Termination Style: | Screw Terminal |
| Series: | - |
| Other Names: | 277-5168 5521814-ND UMK33-REL24/4X21-ST |
| Number of Positions: | 14 |
| Mounting Type: | DIN Rail |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 5 Weeks |
| Manufacturer Part Number: | 5521814 |
| For Use With/Related Products: | - |
| Features: | - |
| Expanded Description: | Relay Socket DIN Rail |
| Description: | RELAY SOCKET |
| Email: | [email protected] |
Related parts for 5521814
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
5521898 | Phoenix Contact | CONN TERM BLOCK | Inquiry |
 |
RSL116079-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Inquiry |
 |
7760056107 | Weidmuller | FS 4CO DRM SOCKET | Inquiry |
|
JRS200300 | Amphenol PCD | QUICK MOUNT, 2 POLE | Inquiry |
 |
154746-2 | TE Connectivity Potter & Brumfield Relays | RELAY BASE HOUSING BLACK | Inquiry |
 |
27E893 | TE Connectivity Potter & Brumfield Relays | SOCKET RELAY DIN RAIL MNT KU | Inquiry |
|
5521830 | Phoenix Contact | RELAY SOCKET | Inquiry |
 |
JW1-SS | Panasonic Electric Works | SOCKET PLUG IN FOR JW1 RELAYS | Inquiry |
 |
5521843 | Phoenix Contact | FLKM2I/O/G4 | Inquiry |
|
M12883/52-001 | Amphenol PCD | CONN BACKSHELL | Inquiry |
 |
5521856 | Phoenix Contact | FLKMI/O/G4 | Inquiry |
|
5521827 | Phoenix Contact | RELAY SOCKET | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers