BYCHIPS is the stocking distributor for 506WLSM0R70KT619T, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 506WLSM0R70KT619T by email, we will give you a best price according your plan.
Buy 506WLSM0R70KT619T with BYCHPS
Buy with guarantee
506WLSM0R70KT619T
- Part Number:
- 506WLSM0R70KT619T
- Manufacturer:
- American Technical Ceramics
- Description:
- FIXED IND 700NH 619MA 320 MOHM
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14616 Pieces
- Data sheet:
- 506WLSM0R70KT619T.pdf
Introduction
Specifications
| Type: | Wirewound |
|---|---|
| Tolerance: | ±10% |
| Supplier Device Package: | - |
| Size / Dimension: | 0.127" L x 0.080" W (3.23mm x 2.03mm) |
| Shielding: | Unshielded |
| Series: | 506WLS |
| Ratings: | - |
| Q @ Freq: | - |
| Packaging: | Original-Reel® |
| Package / Case: | Nonstandard |
| Other Names: | 1284-1316-6 |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | Powdered Iron |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Manufacturer Part Number: | 506WLSM0R70KT619T |
| Inductance: | 700nH |
| Height - Seated (Max): | 0.105" (2.67mm) |
| Frequency - Test: | 1MHz |
| Frequency - Self Resonant: | - |
| Expanded Description: | 700nH Unshielded Wirewound Inductor 619mA 320 mOhm Nonstandard |
| Description: | FIXED IND 700NH 619MA 320 MOHM |
| DC Resistance (DCR): | 320 mOhm |
| Current Rating: | 619mA |
| Current - Saturation: | - |
| Email: | [email protected] |
Related parts for 506WLSM0R70KT619T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers