BYCHIPS is the stocking distributor for 4606M-901-104LF, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 4606M-901-104LF by email, we will give you a best price according your plan.
Buy 4606M-901-104LF with BYCHPS
Buy with guarantee
4606M-901-104LF
- Part Number:
- 4606M-901-104LF
- Manufacturer:
- Bourns, Inc.
- Description:
- CAP ARRAY 0.1UF 50V X7R 6-SIP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12007 Pieces
- Data sheet:
- 4606M-901-104LF.pdf
Introduction
Specifications
| Voltage - Rated: | 50V |
|---|---|
| Tolerance: | ±20% |
| Temperature Coefficient: | X7R |
| Size / Dimension: | 0.602" L x 0.150" W (15.30mm x 3.81mm) |
| Series: | 900 |
| Ratings: | - |
| Packaging: | - |
| Package / Case: | 6-SIP |
| Number of Capacitors: | 5 |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | 4606M-901-104LF |
| Height - Seated (Max): | 0.200" (5.08mm) |
| Expanded Description: | 0.1µF ±20% Bussed Capacitor Array 50V X7R 6-SIP |
| Dielectric Material: | - |
| Description: | CAP ARRAY 0.1UF 50V X7R 6-SIP |
| Circuit Type: | Bussed |
| Capacitance: | 0.1µF |
| Email: | [email protected] |
Related parts for 4606M-901-104LF
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
4606M-101-222LF | Bourns Inc. | RES ARRAY 5 RES 2.2K OHM 6SIP | Inquiry |
|
4606M-101-561LF | Bourns Inc. | RES ARRAY 5 RES 560 OHM 6SIP | Inquiry |
|
4606M-102-471LF | Bourns Inc. | RES ARRAY 3 RES 470 OHM 6SIP | Inquiry |
|
4606M-102-333LF | Bourns Inc. | RES ARRAY 3 RES 33K OHM 6SIP | Inquiry |
|
4606M-101-223LF | Bourns Inc. | RES ARRAY 5 RES 22K OHM 6SIP | Inquiry |
|
4606M-102-473LF | Bourns Inc. | RES ARRAY 3 RES 47K OHM 6SIP | Inquiry |
|
4606M-101-334LF | Bourns Inc. | RES ARRAY 5 RES 330K OHM 6SIP | Inquiry |
|
4606M-102-105LF | Bourns Inc. | RES ARRAY 3 RES 1M OHM 6SIP | Inquiry |
|
4606M-102-101LF | Bourns Inc. | RES ARRAY 3 RES 100 OHM 6SIP | Inquiry |
|
4606M-102-103LF | Bourns Inc. | RES ARRAY 3 RES 10K OHM 6SIP | Inquiry |
|
4606M-102-393LF | Bourns Inc. | RES ARRAY 3 RES 39K OHM 6SIP | Inquiry |
|
4606M-101-560LF | Bourns Inc. | RES ARRAY 5 RES 56 OHM 6SIP | Inquiry |
|
4606M-101-390LF | Bourns Inc. | RES ARRAY 5 RES 39 OHM 6SIP | Inquiry |
|
4606M-101-472LF | Bourns Inc. | RES ARRAY 5 RES 4.7K OHM 6SIP | Inquiry |
|
4606M-102-222LF | Bourns Inc. | RES ARRAY 3 RES 2.2K OHM 6SIP | Inquiry |
|
4606M-101-331LF | Bourns Inc. | RES ARRAY 5 RES 330 OHM 6SIP | Inquiry |
|
4606M-102-272LF | Bourns Inc. | RES ARRAY 3 RES 2.7K OHM 6SIP | Inquiry |
|
4606M-102-102LF | Bourns Inc. | RES ARRAY 3 RES 1K OHM 6SIP | Inquiry |
|
4606M-101-471LF | Bourns Inc. | RES ARRAY 5 RES 470 OHM 6SIP | Inquiry |
|
4606M-101-104LF | Bourns Inc. | RES ARRAY 5 RES 100K OHM 6SIP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers