BYCHIPS is the stocking distributor for 27E046, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 27E046 by email, we will give you a best price according your plan.
Buy 27E046 with BYCHPS
Buy with guarantee
27E046
- Part Number:
- 27E046
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Description:
- SOCKET PCB TERMINAL KU SERIES
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19967 Pieces
- Data sheet:
- 27E046.pdf
Introduction
Specifications
| Type: | Socket |
|---|---|
| Termination Style: | PC Pin |
| Series: | KU |
| Other Names: | 1419106-4 2.70E+49 PB522 |
| Number of Positions: | 11 |
| Mounting Type: | Through Hole |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | 27E046 |
| For Use With/Related Products: | KU Series |
| Features: | - |
| Expanded Description: | Relay Socket Through Hole |
| Description: | SOCKET PCB TERMINAL KU SERIES |
| Email: | [email protected] |
Related parts for 27E046
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
2271235 | Phoenix Contact | PLUG-IN BASE RELAY PIN PLATE | Inquiry |
 |
27E043 | TE Connectivity Potter & Brumfield Relays | SOCKET SOLDER FOR KU RELAYS | Inquiry |
 |
JRS400411 | Amphenol PCD | QUICK MOUNT, 4 POLE WC | Inquiry |
|
2967808 | Phoenix Contact | TERM BLOCK | Inquiry |
|
RSE112065-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Inquiry |
 |
PLE11-0 | Omron Automation and Safety | RELAY SOCKET 3PDT PCB MT MK | Inquiry |
 |
27E317 | TE Connectivity Potter & Brumfield Relays | BRACKET MOUNT SOCKET 2POLES | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers