BYCHIPS is the stocking distributor for 2731-100M, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 2731-100M by email, we will give you a best price according your plan.
Buy 2731-100M with BYCHPS
Buy with guarantee
2731-100M
- Part Number:
- 2731-100M
- Manufacturer:
- Microsemi
- Description:
- TRANS RF BIPO 575W 15A 55KS1
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16773 Pieces
- Data sheet:
- 2731-100M.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 65V |
|---|---|
| Transistor Type: | NPN |
| Supplier Device Package: | 55KS-1 |
| Series: | - |
| Power - Max: | 575W |
| Packaging: | Bulk |
| Package / Case: | 55KS-1 |
| Operating Temperature: | 200°C (TJ) |
| Noise Figure (dB Typ @ f): | - |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | 2731-100M |
| Gain: | 8db ~ 9.4dB |
| Frequency - Transition: | 2.7GHz ~ 3.1GHz |
| Expanded Description: | RF Transistor NPN 65V 15A 2.7GHz ~ 3.1GHz 575W Chassis Mount 55KS-1 |
| Description: | TRANS RF BIPO 575W 15A 55KS1 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 15 @ 600mA, 5V |
| Current - Collector (Ic) (Max): | 15A |
| Email: | [email protected] |
Related parts for 2731-100M
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
1015MP | Microsemi Corporation | TRANS RF BIPO 50W 1A 55FW1 | Inquiry |
|
2731GN-110M | Microsemi Corporation | FETS RF GAN 150V 2.7-3.1GHZ 55QP | Inquiry |
 |
BFP 183 E7764 | Infineon Technologies | TRANSISTOR NPN RF 12V SOT-143 | Inquiry |
|
2731GN-200M | Microsemi Corporation | FETS RF GAN 150V 2.7-3.1GHZ 55QP | Inquiry |
|
2731-20 | Microsemi Corporation | TRANS RF BIPO 70W 1.85 55KCR-1 | Inquiry |
 |
BFR 93AW E6327 | Infineon Technologies | TRANSISTOR NPN RF 12V SOT-323 | Inquiry |
 |
NE685M33-T3-A | CEL | TRANSISTOR NPN 2GHZ M33 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers