BYCHIPS is the stocking distributor for 170H3027, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 170H3027 by email, we will give you a best price according your plan.
Buy 170H3027 with BYCHPS
Buy with guarantee
170H3027
- Part Number:
- 170H3027
- Manufacturer:
- Bussmann (Eaton)
- Description:
- MICROSWITCH K1 2A 250V 3 GOLD
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13989 Pieces
- Data sheet:
- 170H3027.pdf
Introduction
Specifications
| Size / Dimension: | - |
|---|---|
| Series: | * |
| Packaging: | Bulk |
| Package / Case: | - |
| Mounting Type: | - |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 5 Weeks |
| Manufacturer Part Number: | 170H3027 |
| Description: | MICROSWITCH K1 2A 250V 3 GOLD |
| Email: | [email protected] |
Related parts for 170H3027
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
170H3012 | Eaton | MICROSWITCH K1 2A 250V DIODE | Inquiry |
|
170H3030 | Eaton | MICROSWITCH K1 2A 250V 3 3KV | Inquiry |
 |
1003R1IB5.5 | Littelfuse Inc. | FUSE CARTRIDGE 100A 5.5KVAC CYL | Inquiry |
|
C3K | Eaton | FUSE 3A 600V AC C.S.A. FM1 CL 'C | Inquiry |
 |
FWH-.500A6F | Eaton | FUSE CARTRIDGE 500MA 500VAC 3AB | Inquiry |
|
170H3003 | Eaton | FUSE BLOK BLT DWN 1000V 630A CHA | Inquiry |
|
0SPF002.H | Littelfuse Inc. | FUSE CARTRIDGE 2A 1KVDC 5AG | Inquiry |
|
41015 | Eaton | FUSE LK X 15.0A RB 23" | Inquiry |
|
170H3005 | Eaton | FUSE BLOK BLT DWN 1400V 630A CHA | Inquiry |
|
BP/NON-20 | Eaton | BUSS ONE TIME FUSE | Inquiry |
|
170H3006 | Eaton | FUSE BLOCK BOLT DWN 1400V 1.25KA | Inquiry |
|
SPP-7M1000 | Eaton | FUSE MOD 1000A 700V STUD | Inquiry |
|
170H3004 | Eaton | FUSE BLOCK BOLT DWN 1000V 1.25KA | Inquiry |
|
DZ16F4 | Littelfuse Inc. | FUSE CARTRIDGE 4A 500VAC NON STD | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers