BYCHIPS is the stocking distributor for 16SEPF270M+TSS, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 16SEPF270M+TSS by email, we will give you a best price according your plan.
Buy 16SEPF270M+TSS with BYCHPS
Buy with guarantee
16SEPF270M+TSS
- Part Number:
- 16SEPF270M+TSS
- Manufacturer:
- Panasonic
- Description:
- CAP ALUM POLY 270UF 20% 16V T/H
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16985 Pieces
Introduction
Specifications
| Voltage Rating: | 16V |
|---|---|
| Type: | Polymer |
| Tolerance: | ±20% |
| Surface Mount Land Size: | - |
| Size / Dimension: | 0.315" Dia (8.00mm) |
| Series: | OS-CON™, SEPF |
| Ripple Current - Low Frequency: | 165mA @ 120Hz |
| Ripple Current - High Frequency: | 3.3A @ 100kHz |
| Packaging: | Tape & Box (TB) |
| Package / Case: | Radial, Can |
| Other Names: | P16384TB |
| Operating Temperature: | -55°C ~ 105°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | 16SEPF270M+TSS |
| Lifetime @ Temp.: | 5000 Hrs @ 105°C |
| Lead Spacing: | 0.138" (3.50mm) |
| Impedance: | - |
| Height - Seated (Max): | 0.276" (7.00mm) |
| Expanded Description: | 270µF ±20% 16V Aluminum Polymer Capacitor Radial, Can 22 mOhm 5000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | 22 mOhm |
| Description: | CAP ALUM POLY 270UF 20% 16V T/H |
| Capacitance: | 270µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for 16SEPF270M+TSS
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers