BYCHIPS is the stocking distributor for 1111J5002P70BUT, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 1111J5002P70BUT by email, we will give you a best price according your plan.
Buy 1111J5002P70BUT with BYCHPS
Buy with guarantee
1111J5002P70BUT
- Part Number:
- 1111J5002P70BUT
- Manufacturer:
- Knowles / Syfer
- Description:
- CAP CER LOW ESR 1111
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17531 Pieces
- Data sheet:
- 1.1111J5002P70BUT.pdf2.1111J5002P70BUT.pdf
Introduction
Specifications
| Series: | * |
|---|---|
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | 1111J5002P70BUT |
| Expanded Description: | Ceramic Capacitor |
| Description: | CAP CER LOW ESR 1111 |
| Email: | [email protected] |
Related parts for 1111J5002P70BUT
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
1111J5002P70HUT | Knowles Syfer | CAP CER LOW ESR 1111 | Inquiry |
|
1111J5002P70CUT | Knowles Syfer | CAP CER LOW ESR 1111 | Inquiry |
|
1111J5002P70BQT | Knowles Syfer | CAP CER 2.7PF 500V C0G/NP0 1111 | Inquiry |
|
1111J5002P70DQT | Knowles Syfer | CAP CER 2.7PF 500V C0G/NP0 1111 | Inquiry |
|
1111J5002P70CQT | Knowles Syfer | CAP CER 2.7PF 500V C0G/NP0 1111 | Inquiry |
|
1111J5002P70DUT | Knowles Syfer | CAP CER LOW ESR 1111 | Inquiry |
|
1111J5002P40CQT | Knowles Syfer | CAP CER 2.4PF 500V C0G/NP0 1111 | Inquiry |
|
1111J5002P00BUT | Knowles Syfer | CAP CER LOW ESR 1111 | Inquiry |
|
1111J5002P70HQT | Knowles Syfer | CAP CER 2.7PF 500V C0G/NP0 1111 | Inquiry |
|
1111J5002P10BQT | Knowles Syfer | CAP CER HIGH Q 1111 | Inquiry |
|
1111J5002P00DQT | Knowles Syfer | CAP CER 2PF 500V C0G/NP0 1111 | Inquiry |
|
1111J5002P00HUT | Knowles Syfer | CAP CER LOW ESR 1111 | Inquiry |
|
1111J5002P40BQT | Knowles Syfer | CAP CER 2.4PF 500V C0G/NP0 1111 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers