BYCHIPS is the stocking distributor for XC18V256PC20C, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for XC18V256PC20C by email, we will give you a best price according your plan.
Buy XC18V256PC20C with BYCHPS
Buy with guarantee
XC18V256PC20C
- Part Number:
- XC18V256PC20C
- Manufacturer:
- Xilinx
- Description:
- IC PROM SRL CONFIG 256K 20-PLCC
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 15513 Pieces
- Data sheet:
- XC18V256PC20C.pdf
Introduction
Specifications
| Voltage - Supply: | 3 V ~ 3.6 V |
|---|---|
| Supplier Device Package: | 20-PLCC (9x9) |
| Series: | - |
| Programmable Type: | In System Programmable |
| Packaging: | Tube |
| Package / Case: | 20-LCC (J-Lead) |
| Other Names: | 122-1242 XC18V256PC20C-ND |
| Operating Temperature: | 0°C ~ 70°C |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Memory Size: | 256Kb |
| Manufacturer Part Number: | XC18V256PC20C |
| Description: | IC PROM SRL CONFIG 256K 20-PLCC |
| Email: | [email protected] |
Related parts for XC18V256PC20C
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
XC18V512PC20C | Xilinx Inc. | IC PROM SRL CONFIG 512K 20-PLCC | Inquiry |
 |
XC18V256VQ44I | Xilinx Inc. | IC PROM SER I-TEMP 3.3V 44-VQFP | Inquiry |
|
XC18V256VQ44C | Xilinx Inc. | IC PROM SRL CONFIG 256K 44-VQFP | Inquiry |
 |
XC18V256SO20I | Xilinx Inc. | IC PROM SER I-TEMP 3.3V 20-SOIC | Inquiry |
|
XC18V256PC20I | Xilinx Inc. | IC PROM SER I-TEMP 3.3V 20-PLCC | Inquiry |
|
XC18V02VQG44C | Xilinx Inc. | IC PROM REPROGR 2MB 44-VQFP | Inquiry |
|
XC18V256SO20C | Xilinx Inc. | IC PROM SRL CONFIG 256K 20-SOIC | Inquiry |
|
XC18V02PCG44C | Xilinx Inc. | IC PROM REPROGR 2MB 44-PLCC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers