BYCHIPS is the stocking distributor for XA3S100E-4CPG132Q, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for XA3S100E-4CPG132Q by email, we will give you a best price according your plan.
Buy XA3S100E-4CPG132Q with BYCHPS
Buy with guarantee
XA3S100E-4CPG132Q
- Part Number:
- XA3S100E-4CPG132Q
- Manufacturer:
- Xilinx
- Description:
- IC FPGA 83 I/O 132CSBGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16183 Pieces
- Data sheet:
- XA3S100E-4CPG132Q.pdf
Introduction
Specifications
| Voltage - Supply: | 1.14 V ~ 1.26 V |
|---|---|
| Total RAM Bits: | 73728 |
| Supplier Device Package: | 132-CSPBGA (8x8) |
| Series: | Automotive, AEC-Q100, Spartan®-3E XA |
| Package / Case: | 132-TFBGA, CSPBGA |
| Operating Temperature: | -40°C ~ 125°C (TJ) |
| Number of Logic Elements/Cells: | 2160 |
| Number of LABs/CLBs: | 240 |
| Number of I/O: | 83 |
| Number of Gates: | 100000 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 6 Weeks |
| Manufacturer Part Number: | XA3S100E-4CPG132Q |
| Description: | IC FPGA 83 I/O 132CSBGA |
| Email: | [email protected] |
Related parts for XA3S100E-4CPG132Q
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
XA3S100E-4CPG132I | Xilinx Inc. | IC FPGA 83 I/O 132CSBGA | Inquiry |
 |
XA3S1000-4FTG256Q | Xilinx Inc. | IC FPGA 173 I/O 256FTBGA | Inquiry |
 |
XA3S1000-4FGG456Q | Xilinx Inc. | IC FPGA 333 I/O 456FBGA | Inquiry |
 |
XA3S100E-4VQG100I | Xilinx Inc. | IC FPGA 66 I/O 100VQFP | Inquiry |
 |
XA3S100E-4TQG144I | Xilinx Inc. | IC FPGA 108 I/O 144TQFP | Inquiry |
|
XA3S1000-4FTG256I | Xilinx Inc. | IC FPGA 173 I/O 256FTBGA | Inquiry |
|
XA3S100E-4TQG144Q | Xilinx Inc. | IC FPGA 108 I/O 144TQFP | Inquiry |
|
XA3S1000-4FGG456I | Xilinx Inc. | IC FPGA 333 I/O 456FBGA | Inquiry |
|
XA3S100E-4VQG100Q | Xilinx Inc. | IC FPGA 66 I/O 100VQFP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers