BYCHIPS is the stocking distributor for TSB15LV01PFC, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for TSB15LV01PFC by email, we will give you a best price according your plan.
Buy TSB15LV01PFC with BYCHPS
Buy with guarantee
TSB15LV01PFC
- Part Number:
- TSB15LV01PFC
- Manufacturer:
- Description:
- IC CAMERA ASIC/LINK LAYER 80-QFP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18853 Pieces
- Data sheet:
- TSB15LV01PFC.pdf
Introduction
Specifications
| Type: | Video Processor |
|---|---|
| Supplier Device Package: | 80-TQFP (12x12) |
| Series: | - |
| Packaging: | Tray |
| Package / Case: | 80-TQFP |
| Other Names: | 296-11073 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 4 (72 Hours) |
| Manufacturer Part Number: | TSB15LV01PFC |
| Expanded Description: | Video Processor IC Video 80-TQFP (12x12) |
| Description: | IC CAMERA ASIC/LINK LAYER 80-QFP |
| Applications: | Video |
| Email: | [email protected] |
Related parts for TSB15LV01PFC
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
MAX4838AEXT+T | Maxim Integrated | IC CTLR OVP 7.4V SC70-6 | Inquiry |
|
TSB15LV01IPFC | Texas Instruments | IC CAMERA ASIC/LINK LAYER 80TQFP | Inquiry |
 |
LTC4213IDDB#TRMPBF | Linear Technology | IC CIRC BREAK ELEC 8-DFN | Inquiry |
|
TSB15LV01PFCG4 | Texas Instruments | IC CAMERA ASIC/LINK LAYER 80-QFP | Inquiry |
 |
IDT72P51569L6BB8 | IDT, Integrated Device Technology Inc | IC FLOW CTRL 36BIT 256-BGA | Inquiry |
|
MAX4840EXT+T | Maxim Integrated | IC CTLR OVP 5.8V SC70-6 | Inquiry |
 |
NBSG16VSMNHTBG | ON Semiconductor | IC RCVR/DVR SIGE DIFF 16QFN | Inquiry |
 |
DS2411P+T&R | Maxim Integrated | IC SILICON SERIAL NUMBER 6TSOC | Inquiry |
 |
TZA1038HW,118 | NXP USA Inc. | IC DVD SIGNAL PROC 48-HTQFP | Inquiry |
 |
LT3750EMS#TRPBF | Linear Technology | IC CONVERTER 10MSOP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers