BYCHIPS is the stocking distributor for TISP7240F3P, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for TISP7240F3P by email, we will give you a best price according your plan.
Buy TISP7240F3P with BYCHPS
Buy with guarantee
TISP7240F3P
- Part Number:
- TISP7240F3P
- Manufacturer:
- Bourns, Inc.
- Description:
- SURGE SUPP 180V BIDIR 8-DIP
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 18020 Pieces
- Data sheet:
- TISP7240F3P.pdf
Introduction
Specifications
| Voltage - On State: | 5V |
|---|---|
| Voltage - Off State: | 180V |
| Voltage - Breakover: | 240V |
| Series: | - |
| Packaging: | Tube |
| Package / Case: | 8-DIP (0.300", 7.62mm) |
| Number of Elements: | 3 |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | TISP7240F3P |
| Description: | SURGE SUPP 180V BIDIR 8-DIP |
| Current - Peak Pulse (8/20µs): | 175A |
| Current - Peak Pulse (10/1000µs): | 45A |
| Current - Hold (Ih): | 150mA |
| Capacitance: | 39pF |
| Email: | [email protected] |
Related parts for TISP7240F3P
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
TISP7260F3P | Bourns Inc. | SURGE SUPP 200V BIDIR 8-DIP | Inquiry |
|
TISP7240F3DR-S | Bourns Inc. | PROTECTOR TRIPLE BIDIRECTIONAL | Inquiry |
|
TISP7260F3DR | Bourns Inc. | SURGE SUPP 200V BIDIR 8-SOIC | Inquiry |
|
TISP7240F3SL | Bourns Inc. | SURGE SUPP 180V BIDIR 3-SL | Inquiry |
|
TISP7240F3DR | Bourns Inc. | SURGE SUPP 180V BIDIR 8-SOIC | Inquiry |
|
TISP7290F3DR | Bourns Inc. | SURGE SUPP 220V BIDIR 8-SOIC | Inquiry |
|
TISP7210H3SL | Bourns Inc. | SURGE SUPP 160V BIDIR 3-SL | Inquiry |
|
TISP7290F3SL | Bourns Inc. | SURGE SUPP 220V BIDIR 3-SL | Inquiry |
|
TISP7290H3SL | Bourns Inc. | SURGE SUPP 230V BIDIR 3-SL | Inquiry |
|
TISP7290F3P | Bourns Inc. | SURGE SUPP 220V BIDIR 8-DIP | Inquiry |
|
TISP7260F3SL | Bourns Inc. | SURGE SUPP 200V BIDIR 3-SL | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers