BYCHIPS is the stocking distributor for RNCS0603BKE182K, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for RNCS0603BKE182K by email, we will give you a best price according your plan.
Buy RNCS0603BKE182K with BYCHPS
Buy with guarantee
RNCS0603BKE182K
- Part Number:
- RNCS0603BKE182K
- Manufacturer:
- Stackpole Electronics, Inc.
- Description:
- RES SMD 182K OHM 0.1% 1/16W 0603
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18423 Pieces
- Data sheet:
- 1.RNCS0603BKE182K.pdf2.RNCS0603BKE182K.pdf
Introduction
Specifications
| Tolerance: | ±0.1% |
|---|---|
| Temperature Coefficient: | ±25ppm/°C |
| Supplier Device Package: | 0603 |
| Size / Dimension: | 0.061" L x 0.031" W (1.55mm x 0.80mm) |
| Series: | RNCS |
| Resistance (Ohms): | 182k |
| Power (Watts): | 0.063W, 1/16W |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 0603 (1608 Metric) |
| Other Names: | RNCS 16 T9 182K 0.1% I RNCS16T9182K0.1%I RNCS16T9182K0.1%I-ND RNCS16T9182KBI RNCS16T9182KBI-ND |
| Operating Temperature: | -55°C ~ 155°C |
| Number of Terminations: | 2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Manufacturer Part Number: | RNCS0603BKE182K |
| Height - Seated (Max): | 0.022" (0.55mm) |
| Features: | Anti-Corrosive, Automotive AEC-Q200, Moisture Resistant |
| Failure Rate: | - |
| Expanded Description: | 182k Ohm ±0.1% 0.063W, 1/16W Chip Resistor 0603 (1608 Metric) Anti-Corrosive, Automotive AEC-Q200, Moisture Resistant Thin Film |
| Description: | RES SMD 182K OHM 0.1% 1/16W 0603 |
| Composition: | Thin Film |
| Email: | [email protected] |
Related parts for RNCS0603BKE182K
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers