BYCHIPS is the stocking distributor for RLB0608-3R9ML, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for RLB0608-3R9ML by email, we will give you a best price according your plan.
Buy RLB0608-3R9ML with BYCHPS
Buy with guarantee
RLB0608-3R9ML
- Part Number:
- RLB0608-3R9ML
- Manufacturer:
- Bourns, Inc.
- Description:
- FIXED IND 3.9UH 720MA 300 MOHM
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16341 Pieces
- Data sheet:
- RLB0608-3R9ML.pdf
Introduction
Specifications
| Type: | Wirewound |
|---|---|
| Tolerance: | ±20% |
| Supplier Device Package: | - |
| Size / Dimension: | 0.197" Dia (5.00mm) |
| Shielding: | Unshielded |
| Series: | RLB |
| Ratings: | - |
| Q @ Freq: | 60 @ 7.96MHz |
| Packaging: | Bulk |
| Package / Case: | Radial |
| Operating Temperature: | -40°C ~ 105°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | Ferrite |
| Manufacturer Standard Lead Time: | 18 Weeks |
| Manufacturer Part Number: | RLB0608-3R9ML |
| Inductance: | 3.9µH |
| Height - Seated (Max): | 0.295" (7.50mm) |
| Frequency - Test: | 7.96MHz |
| Frequency - Self Resonant: | 45MHz |
| Expanded Description: | 3.9µH Unshielded Wirewound Inductor 720mA 300 mOhm Max Radial |
| Description: | FIXED IND 3.9UH 720MA 300 MOHM |
| DC Resistance (DCR): | 300 mOhm Max |
| Current Rating: | 720mA |
| Current - Saturation: | - |
| Email: | [email protected] |
Related parts for RLB0608-3R9ML
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
RLB0608-471KL | Bourns Inc. | FIXED IND 470UH 140MA 6.5 OHM TH | Inquiry |
|
RLB0608-1R0ML | Bourns Inc. | FIXED IND 1UH 1.03A 100 MOHM TH | Inquiry |
|
RLB0608-121KL | Bourns Inc. | FIXED IND 120UH 290MA 1.9 OHM TH | Inquiry |
|
RLB0608-220KL | Bourns Inc. | FIXED IND 22UH 460MA 650 MOHM TH | Inquiry |
|
RLB0608-271KL | Bourns Inc. | FIXED IND 270UH 180MA 2.75 OHM | Inquiry |
|
RLB0608-1R8ML | Bourns Inc. | FIXED IND 1.8UH 880MA 220 MOHM | Inquiry |
|
RLB0608-561KL | Bourns Inc. | FIXED IND 560UH 135MA 8.5 OHM TH | Inquiry |
|
RLB0608-102KL | Bourns Inc. | FIXED IND 1MH 100MA 11.5 OHM TH | Inquiry |
|
RLB0608-100KL | Bourns Inc. | FIXED IND 10UH 550MA 450 MOHM TH | Inquiry |
|
RLB0608-152KL | Bourns Inc. | FIXED IND 1.5MH 100MA 15 OHM TH | Inquiry |
|
RLB0608-331KL | Bourns Inc. | FIXED IND 330UH 165MA 4.68 OHM | Inquiry |
|
RLB0608-5R6KL | Bourns Inc. | FIXED IND 5.6UH 640MA 350 MOHM | Inquiry |
|
RLB0608-222KL | Bourns Inc. | FIXED IND 2.2MH 85MA 20 OHM TH | Inquiry |
|
RLB0608-391KL | Bourns Inc. | FIXED IND 390UH 150MA 6 OHM TH | Inquiry |
|
RLB0608-1R5ML | Bourns Inc. | FIXED IND 1.5UH 920MA 200 MOHM | Inquiry |
|
RLB0608-2R7ML | Bourns Inc. | FIXED IND 2.7UH 790MA 270 MOHM | Inquiry |
|
RLB0608-180KL | Bourns Inc. | FIXED IND 18UH 480MA 600 MOHM TH | Inquiry |
|
RLB0608-4R7ML | Bourns Inc. | FIXED IND 4.7UH 670MA 350 MOHM | Inquiry |
|
RLB0608-820KL | Bourns Inc. | FIXED IND 82UH 320MA 1.5 OHM TH | Inquiry |
|
RLB0608-270KL | Bourns Inc. | FIXED IND 27UH 430MA 750 MOHM TH | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers