BYCHIPS is the stocking distributor for RAVF164DJT27R0, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for RAVF164DJT27R0 by email, we will give you a best price according your plan.
Buy RAVF164DJT27R0 with BYCHPS
Buy with guarantee
RAVF164DJT27R0
- Part Number:
- RAVF164DJT27R0
- Manufacturer:
- Stackpole Electronics, Inc.
- Description:
- RES ARRAY 4 RES 27 OHM 1206
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13021 Pieces
- Data sheet:
- 1.RAVF164DJT27R0.pdf2.RAVF164DJT27R0.pdf
Introduction
Specifications
| Tolerance: | ±5% |
|---|---|
| Temperature Coefficient: | ±200ppm/°C |
| Supplier Device Package: | - |
| Size / Dimension: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| Series: | RAVF |
| Resistance (Ohms): | 27 |
| Power Per Element: | 62.5mW |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 1206 (3216 Metric), Convex, Long Side Terminals |
| Other Names: | RAV 164D 27 5% R RAV164D275%R RAV164D275%R-ND RAV164D27JR RAV164D27JR-ND RAVF164DJT27R0-ND RAVF164DJT27R0TR |
| Operating Temperature: | -55°C ~ 155°C |
| Number of Resistors: | 4 |
| Number of Pins: | 8 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 11 Weeks |
| Manufacturer Part Number: | RAVF164DJT27R0 |
| Height - Seated (Max): | 0.024" (0.60mm) |
| Expanded Description: | 27 Ohm ±5% 62.5mW Power Per Element Isolated Resistor Network/Array ±200ppm/°C 1206 (3216 Metric), Convex, Long Side Terminals |
| Description: | RES ARRAY 4 RES 27 OHM 1206 |
| Circuit Type: | Isolated |
| Applications: | Automotive AEC-Q200 |
| Email: | [email protected] |
Related parts for RAVF164DJT27R0
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers