BYCHIPS is the stocking distributor for R9G20411CSOO, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for R9G20411CSOO by email, we will give you a best price according your plan.
Buy R9G20411CSOO with BYCHPS
Buy with guarantee
R9G20411CSOO
- Part Number:
- R9G20411CSOO
- Manufacturer:
- Powerex, Inc.
- Description:
- DIODE FAST REC R9G 1100A 400V
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15324 Pieces
- Data sheet:
- R9G20411CSOO.pdf
Introduction
Specifications
| Series: | * |
|---|---|
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | R9G20411CSOO |
| Expanded Description: | Diode |
| Description: | DIODE FAST REC R9G 1100A 400V |
| Email: | [email protected] |
Related parts for R9G20411CSOO
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
R9G20611CSOO | Powerex Inc. | DIODE FAST REC R9G 1100A 600V | Inquiry |
|
R9G20611ASOO | Powerex Inc. | DIODE FAST REC R9G 1100A 600V | Inquiry |
|
R9G20209ASOO | Powerex Inc. | DIODE FAST REC R9G 900A 200V | Inquiry |
|
R9G20412CSOO | Powerex Inc. | DIODE MODULE 400V 1200A DO200AB | Inquiry |
|
R9G20612CSOO | Powerex Inc. | DIODE MODULE 600V 1200A DO200AB | Inquiry |
|
R9G20411ASOO | Powerex Inc. | DIODE FAST REC R9G 1100A 400V | Inquiry |
|
R9G20809CSOO | Powerex Inc. | DIODE FAST REC R9G 900A 800V | Inquiry |
|
R9G20209CSOO | Powerex Inc. | DIODE FAST REC R9G 900A 200V | Inquiry |
|
R9G20409ASOO | Powerex Inc. | DIODE FAST REC R9G 900A 400V | Inquiry |
|
R9G20409CSOO | Powerex Inc. | DIODE FAST REC R9G 900A 400V | Inquiry |
|
R9G20415ASOO | Powerex Inc. | DIODE MODULE 400V 1500A DO200AB | Inquiry |
|
R9G20811ASOO | Powerex Inc. | DIODE FAST REC R9G 1100A 800V | Inquiry |
|
R9G20615ASOO | Powerex Inc. | DIODE MODULE 600V 1500A DO200AB | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers