BYCHIPS is the stocking distributor for PWR263S-35-R300F, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for PWR263S-35-R300F by email, we will give you a best price according your plan.
Buy PWR263S-35-R300F with BYCHPS
Buy with guarantee
PWR263S-35-R300F
- Part Number:
- PWR263S-35-R300F
- Manufacturer:
- Bourns, Inc.
- Description:
- RES SMD 0.3 OHM 1% 35W D2PAK
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13505 Pieces
- Data sheet:
- PWR263S-35-R300F.pdf
Introduction
Specifications
| Tolerance: | ±1% |
|---|---|
| Temperature Coefficient: | ±100ppm/°C |
| Supplier Device Package: | D2PAK |
| Size / Dimension: | 0.398" L x 0.409" W (10.10mm x 10.40mm) |
| Series: | PWR263S-35 |
| Resistance (Ohms): | 0.3 |
| Power (Watts): | 35W |
| Packaging: | Tube |
| Package / Case: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Operating Temperature: | -55°C ~ 155°C |
| Number of Terminations: | 2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 13 Weeks |
| Manufacturer Part Number: | PWR263S-35-R300F |
| Height - Seated (Max): | 0.192" (4.88mm) |
| Features: | Automotive AEC-Q200, Current Sense, Pulse Withstanding |
| Failure Rate: | - |
| Expanded Description: | 0.3 Ohm ±1% 35W Chip Resistor TO-263-3, D²Pak (2 Leads + Tab), TO-263AB Automotive AEC-Q200, Current Sense, Pulse Withstanding Thick Film |
| Description: | RES SMD 0.3 OHM 1% 35W D2PAK |
| Composition: | Thick Film |
| Email: | [email protected] |
Related parts for PWR263S-35-R300F
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers