BYCHIPS is the stocking distributor for PS22A76, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for PS22A76 by email, we will give you a best price according your plan.
Buy PS22A76 with BYCHPS
Buy with guarantee
PS22A76
- Part Number:
- PS22A76
- Manufacturer:
- Powerex, Inc.
- Description:
- MOD IPM 1200V 25A LARGE DIP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13475 Pieces
- Data sheet:
- PS22A76.pdf
Introduction
Specifications
| Voltage - Isolation: | 2500VDC |
|---|---|
| Voltage: | 1200V |
| Type: | IGBT |
| Series: | DIPIPM™ |
| Package / Case: | 42-PowerDip Module (1.404", 35.67mm) |
| Other Names: | 835-1050 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 20 Weeks |
| Manufacturer Part Number: | PS22A76 |
| Expanded Description: | Power Driver Module IGBT 3 Phase 1200V 25A 42-PowerDip Module (1.404", 35.67mm) |
| Description: | MOD IPM 1200V 25A LARGE DIP |
| Current: | 25A |
| Configuration: | 3 Phase |
| Email: | [email protected] |
Related parts for PS22A76
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
PM100DSA120 | Powerex Inc. | MOD IPM DUAL 1200V 100A | Inquiry |
 |
PS22A74 | Powerex Inc. | MOD IPM 1200V 15A LARGE DIP | Inquiry |
 |
PS22A78-E | Powerex Inc. | MOD IPM 1200V 35A LARGE DIP | Inquiry |
|
PS12013-A | Powerex Inc. | MOD IPM 3PHASE IGBT 1200V 5A | Inquiry |
 |
FSB50450T | Fairchild/ON Semiconductor | IC SPM 500V 3.0A 3PH SPM23AC | Inquiry |
 |
PS22A73 | Powerex Inc. | MOD IPM 1200V 10A LARGE DIP | Inquiry |
 |
PS22A72 | Powerex Inc. | MOD IPM 1200V 5A LARGE DIP | Inquiry |
 |
FPAB30BH60B | Fairchild/ON Semiconductor | MOD SPM 600V 30A SPM27-IC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers