BYCHIPS is the stocking distributor for MPC9456ACR2, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MPC9456ACR2 by email, we will give you a best price according your plan.
Buy MPC9456ACR2 with BYCHPS
Buy with guarantee
MPC9456ACR2
- Part Number:
- MPC9456ACR2
- Manufacturer:
- IDT (Integrated Device Technology)
- Description:
- IC CLK BUFFER 1:10 250MHZ 32TQFP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13701 Pieces
- Data sheet:
- MPC9456ACR2.pdf
Introduction
Specifications
| Voltage - Supply: | 2.375 V ~ 3.465 V |
|---|---|
| Type: | Fanout Buffer (Distribution), Divider, Multiplexer, PLL |
| Supplier Device Package: | 32-TQFP (7x7) |
| Series: | - |
| Ratio - Input:Output: | 1:10 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 32-LQFP |
| Output: | LVCMOS |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Circuits: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | MPC9456ACR2 |
| Input: | LVCMOS, LVPECL |
| Frequency - Max: | 250MHz |
| Expanded Description: | Clock Fanout Buffer (Distribution), Divider, Multiplexer, PLL IC 250MHz 32-LQFP |
| Differential - Input:Output: | Yes/No |
| Description: | IC CLK BUFFER 1:10 250MHZ 32TQFP |
| Email: | [email protected] |
Related parts for MPC9456ACR2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers