BYCHIPS is the stocking distributor for MLZ2012M3R3HT000, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MLZ2012M3R3HT000 by email, we will give you a best price according your plan.
Buy MLZ2012M3R3HT000 with BYCHPS
Buy with guarantee
MLZ2012M3R3HT000
- Part Number:
- MLZ2012M3R3HT000
- Manufacturer:
- TDK Corporation
- Description:
- FIXED IND 3.3UH 500MA 200 MOHM
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19005 Pieces
- Data sheet:
- MLZ2012M3R3HT000.pdf
Introduction
Specifications
| Type: | Multilayer |
|---|---|
| Tolerance: | ±20% |
| Supplier Device Package: | 0805 (2012 Metric) |
| Size / Dimension: | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| Shielding: | Shielded |
| Series: | MLZ |
| Ratings: | - |
| Q @ Freq: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 0805 (2012 Metric) |
| Other Names: | 445-15749-2 MLZ2012M3R3H |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | Ferrite |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Manufacturer Part Number: | MLZ2012M3R3HT000 |
| Inductance: | 3.3µH |
| Height - Seated (Max): | 0.057" (1.45mm) |
| Frequency - Self Resonant: | - |
| Expanded Description: | 3.3µH Shielded Multilayer Inductor 500mA 260 mOhm Max 0805 (2012 Metric) |
| Description: | FIXED IND 3.3UH 500MA 200 MOHM |
| DC Resistance (DCR): | 260 mOhm Max |
| Current Rating: | 500mA |
| Current - Saturation: | 350mA |
| Email: | [email protected] |
Related parts for MLZ2012M3R3HT000
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers