BYCHIPS is the stocking distributor for MAX153EAP, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MAX153EAP by email, we will give you a best price according your plan.
Buy MAX153EAP with BYCHPS
Buy with guarantee
MAX153EAP
- Part Number:
- MAX153EAP
- Manufacturer:
- Maxim Integrated
- Description:
- IC ADC 8BIT PAR 1MSPS 20SSOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18142 Pieces
- Data sheet:
- 1.MAX153EAP.pdf2.MAX153EAP.pdf
Introduction
Specifications
| Voltage - Supply, Digital: | ±5V, 5V |
|---|---|
| Voltage - Supply, Analog: | ±5V, 5V |
| Supplier Device Package: | 20-SSOP |
| Series: | - |
| Sampling Rate (Per Second): | 1M |
| Reference Type: | External |
| Ratio - S/H:ADC: | 1:1 |
| Packaging: | Tube |
| Package / Case: | 20-SSOP (0.209", 5.30mm Width) |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Inputs: | 1 |
| Number of Bits: | 8 |
| Number of A/D Converters: | 1 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | MAX153EAP |
| Input Type: | Single Ended |
| Features: | - |
| Expanded Description: | 8 Bit Analog to Digital Converter 1 Input 1 Flash 20-SSOP |
| Description: | IC ADC 8BIT PAR 1MSPS 20SSOP |
| Data Interface: | Parallel |
| Configuration: | S/H-ADC |
| Architecture: | Flash |
| Email: | [email protected] |
Related parts for MAX153EAP
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers