BYCHIPS is the stocking distributor for DS4550E, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for DS4550E by email, we will give you a best price according your plan.
Buy DS4550E with BYCHPS
Buy with guarantee
DS4550E
- Part Number:
- DS4550E
- Manufacturer:
- Maxim Integrated
- Description:
- IC GPIO 9BIT NV I2C & JTAG TSSOP
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 15097 Pieces
- Data sheet:
- DS4550E.pdf
Introduction
Specifications
| Voltage - Supply: | 2.7 V ~ 5.5 V |
|---|---|
| Supplier Device Package: | 20-TSSOP |
| Series: | - |
| Packaging: | Tube |
| Package / Case: | 20-TSSOP (0.173", 4.40mm Width) |
| Output Type: | Open Drain |
| Operating Temperature: | -40°C ~ 85°C |
| Number of I/O: | 9 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | DS4550E |
| Interrupt Output: | No |
| Interface: | I²C, JTAG |
| Features: | EEPROM, POR |
| Expanded Description: | I/O Expander 9 I²C, JTAG 20-TSSOP |
| Description: | IC GPIO 9BIT NV I2C & JTAG TSSOP |
| Current - Output Source/Sink: | 16mA |
| Clock Frequency: | 400kHz |
| Email: | [email protected] |
Related parts for DS4550E
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
XRA1201IL24-F | Exar Corporation | IC I/O PORT EXPANDER I2C 24QFN | Inquiry |
 |
DS4550E+ | Maxim Integrated | IC I/O EXPANDER I2C 9B 20TSSOP | Inquiry |
 |
MCP23008T-E/ML | Microchip Technology | IC I/O EXPANDER I2C 8B 20QFN | Inquiry |
|
DS4550E+T&R | Maxim Integrated | IC I/O EXPANDER I2C 9B 20TSSOP | Inquiry |
 |
CS82C55A-5 | Intersil | IC I/O EXPANDER 24B 44PLCC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers