BYCHIPS is the stocking distributor for DS08MB200TSQ/NOPB, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for DS08MB200TSQ/NOPB by email, we will give you a best price according your plan.
Buy DS08MB200TSQ/NOPB with BYCHPS
Buy with guarantee
DS08MB200TSQ/NOPB
- Part Number:
- DS08MB200TSQ/NOPB
- Manufacturer:
- Description:
- IC MULTIPLEXER LVDS 4CH 48WQFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13886 Pieces
- Data sheet:
- DS08MB200TSQ/NOPB.pdf
Introduction
Specifications
| Voltage - Supply: | 3 V ~ 3.6 V |
|---|---|
| Type: | Buffer, Multiplexer |
| Supplier Device Package: | 48-WQFN (7x7) |
| Signal Conditioning: | - |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 48-WFQFN Exposed Pad |
| Output: | LVDS |
| Other Names: | DS08MB200TSQ DS08MB200TSQ/NOPBTR DS08MB200TSQNOPB DS08MB200TSQTR DS08MB200TSQTR-ND |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Channels: | 4 x 1:2, 2:1 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 6 Weeks |
| Manufacturer Part Number: | DS08MB200TSQ/NOPB |
| Input: | BLVDS, CML, LVDS, LVPECL |
| Expanded Description: | Buffer, Multiplexer 4 x 1:2, 2:1 Channel 800Mbps 48-WQFN (7x7) |
| Description: | IC MULTIPLEXER LVDS 4CH 48WQFN |
| Delay Time: | 1.0ns |
| Data Rate (Max): | 800Mbps |
| Current - Supply: | 225mA |
| Capacitance - Input: | 3.5pF |
| Applications: | LVDS |
| Email: | [email protected] |
Related parts for DS08MB200TSQ/NOPB
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
|
DS08MB200TSQX/NOPB | Texas Instruments | IC MULTIPLEXER LVDS 4CH 48WQFN | Inquiry |
|
DS25BR120TSDX/NOPB | Texas Instruments | IC REDRIVER LVDS 1CH 8WSON | Inquiry |
|
DS100KR800SQE/NOPB | Texas Instruments | IC REDRIVER 8CH 10.3GBPS 54WQFN | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers