BYCHIPS is the stocking distributor for DLP7000UVFLP, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for DLP7000UVFLP by email, we will give you a best price according your plan.
Buy DLP7000UVFLP with BYCHPS
Buy with guarantee
DLP7000UVFLP
- Part Number:
- DLP7000UVFLP
- Manufacturer:
- Description:
- IC DLP 0.7XGA TYPE A UV 203LCCC
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16943 Pieces
- Data sheet:
- DLP7000UVFLP.pdf
Introduction
Specifications
| Type: | Digital Micromirror Device (DMD) |
|---|---|
| Supplier Device Package: | 203-LCCC |
| Series: | - |
| Packaging: | Tray |
| Package / Case: | 203-LCCC |
| Other Names: | 296-43175 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | DLP7000UVFLP |
| Expanded Description: | Digital Micromirror Device (DMD) IC 3D, Medical Imaging 203-LCCC |
| Description: | IC DLP 0.7XGA TYPE A UV 203LCCC |
| Applications: | 3D, Medical Imaging |
| Email: | [email protected] |
Related parts for DLP7000UVFLP
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
|
DLP7000FLP | Texas Instruments | IC XGA TYPE-A DMD 0.7 203LCCC | Inquiry |
|
DLP9500UVFLNCM | Texas Instruments | IC DMD UV TYPE-A 1080P 355LCCC | Inquiry |
 |
841402DKILFT | IDT, Integrated Device Technology Inc | IC SWITCH RIO | Inquiry |
|
DLP7000BFLP | Texas Instruments | IC XGA TYPE-A DMD 0.7 203LCCC | Inquiry |
|
DLP7000UVFLP-CM | Texas Instruments | DLP7000UVFLP-CM | Inquiry |
|
80HCPS1432RM | IDT, Integrated Device Technology Inc | IC RIO SWITCH GEN2 576FCBGA | Inquiry |
 |
AT88SA102S-TH-T | Microchip Technology | IC PRODUCT AUTHENTICATION 8TSSOP | Inquiry |
|
DLPC900ZPC | Texas Instruments | DIGITAL CONTROLLER FOR DLP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers